Macquarie Semiconductor and Technology on behalf of Macquarie Semiconductor and Technology Inc.

Disco Hi-Tec DAD3350

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Asset ID: 215511

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Disco Hi-Tec

DAD3350

Wafer Dicing Saw

Sawing

Equipment details:

Date of Manufacture: 2013-01-09

Currently Configured for: 200mm

Current Equipment Status: Available

Location of Equipment: San Jose, United States

Available date: TBD

Good and working condition with upgraded Software Package for Machine Operation.

Audit to verify

================ Reference : OEM Feature ====================

DAD3350 Automatic Dicing Saw

Supports a wide range of applications

DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. Support for blades of up to Φ5 inches is possible with user-specified specifications. In addition, the alignment function for multiple-mounted workpieces can also be added as an option.

Improved throughput

The DAD3350 achieves improvement in throughput by increasing the speed of each axis.

Ease of use

Operability is improved with installation of an LCD touch screen and Graphical User Interface (GUI). Easy operation is achieved with a visual display showing processing conditions and various statuses with icon buttons. In addition, operation commonalities were considered in order to achieve easy replacement from the 300/500 series (existing models).

Process quality

By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage and vibration, a more stable processing point can be achieved.

Process controls

Auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed to improve equipment productivity. In addition, the microscope includes an air blow mechanism and a lens shutter to prevent contamination. As an option, a low magnification microscope can be added for rough alignment. Through condition monitoring the processing conditions and various other statuses can be known at any given time. Advanced process control features can be added as options, including an on-screen cutting water management system for cutting water flow control.

Specifications

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Product images

The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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