Tokyo Electron Ltd. (TEL) CLEAN TRACK LITHIUS Pro V

DESCRIPTION

·        5 Blocks Interfaced; 1 Carrier, 2 Multi Purpose, 1 Process, and 1 Interface Block

·        6 Wafer Transfer Robot Arms; 1 Carrier, 2 Multi Purpose, 3 Process, and 1 Interface Arm

·        Facilities location is through the floor

·        Coater direct floordrain

·        Developer direct floordrain

·        Stainless exhaust linesbelow track

·        Addition of coaterdelay timer to EMO line

·        SECSI, SECSII, HSMS& GEM interface required is iUSC

·        E87/GJG compliance

Cassette Station Block(CSB) - Quantity 1

·        5 Cassette FOUPdesign

·        250wph Cassette RoboticArm (CRA)

·        Carrier RFID Function on CSB

·        CSB pressure sensor

Main Block with 5 Process Stacks- Quantity 1

Stack 1 &2 - Developer Processing

·        8 Developer Cups(4 per stack)with common nozzle arms

·        “MGP” and/or LD nozzles withtemp control

·        8 ADR Nozzlesparts (1 per Developer Cup)

·        8 Sets of Back SideRinse Nozzles (1 per Developer Cup)

·        Bulk-FSI system for developer

·        External Thermo Controller System in STHC

Stack 3 CoaterProcessing

·        4 Coater cupswith individual backside rinse nozzles

·        6 - 1.2mmresist nozzles and 1 – SRRC nozzlewith temp control

·        EBR angle adjustment capability

·        Bulk FSI systemfor solvent dispense

·        Exhaust pressure control(EPC)

·        Exhaust duct and drain case cleaning function

·        External thermos controller system in STHC

·        Dispense detection system

·        Bevel rinse nozzle

Stack 4 Coaterprocessing

·        Dummy layer

Stack 5 CoaterProcessing

·        Dummy layer

Chilling Adhesion Process Station (CADH) – Quantity 6 or 9

·        Wafer Wedging function using plate temperature sensor software calculation

·        1 - BubblerType HMDS Tanklocated in main process block

Slim Chill PlateProcess Station (SCPL)

·        Wafer wedging function using vacuum detection sensor

Chill Plate ProcessStation (CPL)

·        Wafer wedging function using vacuum detection sensor

Chilling High Precision Rapid Temperature Hot Plate ProcessStation (CPRP)

·        Wafer Wedging function using plate temperature sensor software calculation

·        0.1mm Gap pin - ceramic type proximity pinson chilling arm (option)

Interface Block Sub (IFBS)

·        IRA robotic arm for wafertransfer and interface panel to accommodate:

·        Nikon S320

·        Interface pulls from both sides

TEL System Temperature and Humidity Controller (STHC)

·        Should be placeddirectly below Trackin subfab, < 10m

·        1 - Shinwaunit for systemenvironment control, chemical temperature control, and CPL temperature control.

·        1 - ReturnAir Box - Plenum

Chemical Cabinet

·        Should be placedin subfab, < 10m awayfrom Track w/ no morethan 3 –90 degree bendsin tubing

·        1 HMDS Canister (3 gallons w/ gauge)

·        3-pump Solvent chemical supply system (Quantity 1)

·        3-pump Developer chemical supply system (Quantity 2)

·        1– Sub operational panel

·        Top side facility connection

AC Power Box

·        Placed in subfab< 10 metersaway from Track

·        Dual feed facility supply power withtwo separate breakers

·        Top side facility connection