Macquarie Semiconductor and Technology on behalf of Intel Resale Corporation
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Multi Block (Resist Coater/Developer)
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Chandler, United States
Available date: Currently Available
General:
· Stack 1: (2) Dev Cups with common arm and (2) NTD Cups with Individual Nozzles
· Stack 2: (2) Dev Cups with common arm and (2) NTD Cups with Individual Nozzles
· Stack 3: (4) COT Cups with (10) Resist Nozzles
· Stack 4: (2) Dev Cups with common arm and 2 NTD Cups with Individual Nozzles
· Stack 5: (4) COT Cups with (6) Resist Nozzles
· (5) SRS for Pre-Immersion Rinse
· (4) PIR for Post Immersion Rinse
· Cassette Block
· (5) FOUP Loadports
· Carrier RFID capability on CSB
· CSB Pressure Sensor
· Main Block with 5 Process Stacks
· Stack 1 & 2 Developer Processing
o (4) Dev cups with (2) common arms and (4) NTD cups with individual nozzle arms
o (2) MGP nozzles with temp control (one for each stack), (4) 2mm NTD nozzles w temp control (one per NTD cup)
o (2) ADR nozzles (1 per stack), (4) PDR nozzles with N2 purge (1 per NTD cup)
o (4) sets of bevel rinse nozzles (1 per NTD cup)
o (8) sets of back side rinse nozzles (1 per cup)
o Bulk FSI system for Developer
o External Thermo Controller System in STHC
o Separate solvent base drain
o Pre-Plumbing for future FIRM field retrofit option
· Stack 3 Coater Processing
o (4) Coater Cups with backside rinse nozzles
o (10) 1.2mm Resist nozzles
o (1) SRRC nozzle with Temp control per stack
o (10) 3ml CRD resist dispense pumps
o (10) Single Bottle Resist Supply Configurations
o EBR angle adjustment capability
o Bulk-FSI system for solvent dispense
o Exhaust Pressure Control (EPC) per stack
o Exhaust duct and drain case cleaning function
o External Thermo Controller System in STHC
o Bevel Rinse nozzle (Ver 2)
o (4) Dispense Detection Systems (COT)
· Stack 4 Developer Processing
o (2) Dev cups with (1) common arms and (2) NTD cups with individual nozzle arms
o (1) MGP nozzles with temp control (one for both Dev), (2) 2mm NTD nozzles w temp control (one per NTD cup)
o (1) ADR nozzles (1 per stack), (2) PDR nozzles with N2 purge (1 per NTD cup)
o (2) sets of bevel rinse nozzles (1 per NTD cup)
o (4) sets of back side rinse nozzles (1 per cup)
o Bulk FSI system for Developer
o External Thermo Controller System in STHC
o Separate solvent base drain
o Pre-Plumbing for future FIRM field retrofit option
· Stack 5 Top Coater Processing
o (4) Coater Cups with backside rinse nozzles
o (6) 1.2mm Resist nozzles and
o (1) SRRC nozzle with Temp control per stack
o (6) 3ml CRD resist dispense pumps
o (6) Single Bottle Resist Supply Configurations
o EBR angle adjustment capability
o Bulk-FSI system for solvent dispense
o Exhaust Pressure Control (EPC) per stack
o Exhaust duct and drain case cleaning function
o External Thermo Controller System in STHC
o Bevel Rinse nozzle (Ver 2)
o (4) Dispense Detection Systems (COT)
· (9) Chilling Adhesion Processing Station (CADH)
o Wafer Wedging function using Plate Temperature sensor SW
o (1) Bubbler Type HMDS Tank located in Main processing block
· (9or12) Slim Chill Plate Process Station (SCPL)
o Wafer wedging function using vacuum detection sensor
· (2or4) Chill Plate Process Station (CPL)
o Wafer wedging function using optical detection sensor
· (19or33) Chilling High Precision Hot Plate Process Station (CPRP)
o A Wafer Wedging function using Plate Temperature sensor SW
o 0.1mm Gap Pin type ceramic proximity pins on chilling arm
· (1) Immersion Process Block (IPRB)
o IPRA Robotic Arm for Wafer Transfer
o (5) Spin Rinse Process Station (SRS) w/IDR nozzle and N2 Capability
o (5) Immersion Edge nozzles (IE) 1 per SRS
o (4) Post Immersion Rinse Process Stations PIR w/IDR nozzle and N2
· (1) Interface Block Sub (IFBS)
o IRAI Robotic Arm for Wafer Transfer
o Interface pulls from both sides
· (1) TEL System Temp and Humidity Controller (STHC)
o (1) Shinwa unit for system environment control, chemical temperature control and CPL temperature control
o (2) Return Air Box - Plenum
· (2) Chemical Cabinets
o (1) HMDS Canister
o (1) 3-Pump Solvent chemical supply system
o (1) 3-Pump NTD chemical supply system
o (1) 2-pump NTR chemical supply system
o (2) 3-Pump Developer chemical supply system
o (1) Sub operation panel
o Top side facility connection
· (1) AC Power Box
o Dual feed supply power with two separate breakers
Top side facility connection
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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