Macquarie Semiconductor and Technology on behalf of Intel Resale Corporation
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Film Thickness Measurement System
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Portland, United States
Available date: Currently Available
§ 300mm FOUP Load/Transfer Interface
§ Measurements for Single/Multi-Layer Film Stacks:
o Non-Destructive Optical Thickness
o Reflectivity
o Index of Refraction
o Extinction Coefficient
o Interference Intensity of Reflected Light
o Polarization Changes of Reflected Light
§ Measurement Systems:
o Dual Beam Spectrometry (DBS)
o Spectroscopic Ellipsometry (SE)
o Wafer Bow Wafer Stress (WBWS) film characteristic
§ Measurement Ranges:
o 300Å to 25µm measurement range
o 0Å to 10,000Å (1µ) measurement range
§ User Interface:
o Front and Rear User Interface / Tool Console
o SECS II/GEM Communication Interface
o Summit System Software
§ Other Features:
o Capability (KLA-Tencor Specs)
o Qualified for Class 1 Cleanroom Environment
o Vision Search capabilities for patterned wafers
o CE Compliant
§ Additional Information available upon request
NOTE: Tool configuration shown is accurate to the knowledge of Intel Resale Corporation. Actual configuration may vary. All sales are “as is” and buyer is advised to conduct its own inspections. Other names and brands may be claimed as the property of others.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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