Macquarie Semiconductor and Technology on behalf of Intel Resale Corporation
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Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Portland, United States
Available date: Currently Available
· Slam Stand Alone Track
· 2 Wafer Transfer Robot Arms: 1 Carrier, 1 Process
· 3 FOUP Loader Port
· SECS/GEM I/II Interface required is iUSC
· 2 SOG Coater Process Station
o 2 SOG Nozzles w/ Temperature Control
o 4 Solvent Capability
o TARC Compatible: Teflon Coated Chamber
o PTI Mass Flow Exhaust Controller
o Temperature Humidity Control
o 1 Set of SS Back Rinse and Cup Rinse Nozzles
· 4 Chill Plate Process Station
· 1 Transfer Chill Plate Process Station
· 3 Transfer Low Temperature Hot Plate (LHP)
· 6 High Temp Hot Plate Process Stations (HHP)
· 1 TEL Temperature and Humidity Controller
· Side Chemical Cabinet
o 8 – 2.5 L Bottle Storage Capacity
o 4 – 2.5 L Bottle Storage Capacity
o 4 – 12 L Tank Solvent Canisters
· 1 AC Power Box
· Additional details available upon request
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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