Macquarie Equipment Trading on behalf of Micron Technology Taiwan, Inc. (F11)

Lam Research EOS

Asset ID: 67442

Print spec sheet

Lam Research

EOS

Single Wafer Processing

Etch/Clean - Wet Processing

Equipment details:

Date of Manufacture: 2015

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: Currently Available

Process: BACKETCH

 

Tool config is based on original PO, please verify tool details at tool inspection

 

FID: 157426

Tool S/N: E14

Reference Tool S/N: E6

 

EOS Product Type

EOS Front Section ES

EOS Rear Section ES

 

Front End Load Port: 4 FOUP TDK

Carrier ID: Brooks Carrier ID reader

Factory Automation: OHT PIO Sensor

User Interface Options: Side Only (Ballroom)

Signal Tower: R-O-G-B Silm Line

Handling system: Standard Handling

Process Module Ionization: PM Ionixation 16 chamber

Platform Doors: Door with Windows 

Okatform Lights: Wite LEDs

Number of Power Supply Lines: 2 Supply Feed

System Power Supply: 208V and 480V 50/60 Hz

Interconnect Com. Cables: 30m Cab;es to Subpanel

PC Power supply: Internal UPS

Fire Suppression

 

Front Section & Rear Section

EOS ES Media#1

Chemistry 1: dHF (supply to TL)

Chemistry 1 Dispense: double side dispense

Chemistry 1 Dispense mode: Drain & recirculation

Chemistry 1 Preparation: 2 Chemical Mix (High Flow) NSR

Chemical 1 Temperature Mixing: Not Present: Local NSR

Chemistry 1 Life Time Exp.: Top-up

Chem. 1 Temp. Specification: 24-40C

Chemical 1 Filter Preparation: Filter Housing

Chem. 1 Gilter Catridge: Filter Pore Size 20nm

Internal Chemical 1 AnalyzersL Horiba HF-960M

External Chemical 1 Analyzers: Not present

Chem 1 Analyzer Saple collerL Not Present

 

EOS ES Media#2

Chemistry 2: Not present

 

EOS ES Media#3

Chemistry 3: Not present

 

EOS ES PM

Chuck: DS Chuck (Std. & Solb. less than 60C)

Drying: ASD3+

IPA Options: Standard

IPA Filter Cartridge: Lam Spplied IPA Filter

Partical Removal Options: A-Jet (DI/CO2)

Drain Separation (Rinse Level): 3 Media

Level 3- Drain#1: Rinse Medua (DI)

Level 3- Drain#2: IPA- High Concentration

Level 30 Drain#3: IPA- Low Concentration

Exhaust Separation: BB-L1 & L2-Exh. 1, Le-Exh1,2

Media 1 Dispense Single Nozzle

Media 2 Dispense: Single Nozzle

OptionsL Continuos Wet Wafer

                                                  

Damage/Missing parts list

Please inspect tool to reconfirm

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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