Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)
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Date of Manufacture:
Currently Configured for: N/A
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
Audit to verify
======================= OEM Feature ===========================
FC3000W series Flip Chip Bonder for Chip on Wafer (COW)
Flip chip bonder (for Chip on Wafer)
Capable of stacking application in various programs for handling 3D packaging.
Can be used in various work processes such as flux, NCP, NCF, and Cu pillars.
Ultra-low pressure head; face up unit; dispenser; flux; bonding inspection unit; upper communication, etc.
FC3000WS
Semi-automatic flip chip bonder for small volume production.
FC3000W
Fully automatic flip chip bonder with chip loader.
FC3000WL
Fully automatic flip chip bonder for mass production, with chip feeder, and wafer loader/unloader.
| Specification/Model | FC3000WS | FC3000W | FC3000WL |
|---|---|---|---|
| Machine type | Semi-automatic COW bonder for R&D use | Bonder with chip loader for mass production use | COW bonder with chip loader and wafer loader/unloader for mass production use |
| Substrate size | 8”,12” t=0.725-1(㎜) | 8”,12” t=0.725-1(㎜) | 8”,12” t=0.725-1(㎜) |
| Chip size (mm): Thermo-compression bonding *1 | 3–20 mm long x 3–20 mm wide (t=0.05–1.0 mm) | 3–20 mm long x 3–20 mm wide (t=0.05–1.0 mm) | 3–20 mm long x 3–20 mm wide (t=0.05–1.0 mm) |
| Chip type | 1-4 | 1 | 1 |
| Chip loading method | 2”/4” tray | Wafer or tray pallet | Wafer or tray pallet |
| Chip orientation | Face down(Face up possible with an optional unit) | Face up | Face up |
| Cycle time *2 | 6.0sec/chip(when flipper is used) | 2.0sec/chip | 2.0sec/chip |
| Alignment accuracy (3 σ)*3 | ±2μm(X,Y) | ±2μm(X,Y) | ±2μm(X,Y) |
| Bonding head type | Ceramic heater head：temperature RT-450℃ | Ceramic heater head：temperature RT-450℃ | Ceramic heater head：temperature RT-450℃ |
NOTE
*1 Large-sized chip (max. 30.0 mm long x 30.0 mm wide) can be processed as an option.
*2 Cycle time does not include processing time (i.e. searching, bonding and vacuum release).
*3 Accuracy measurement is taken using Toray-standard substrates.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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