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Macquarie Semiconductor and Technology on behalf of Micron Technology, Inc. (VA)

Ulvac Corporation Entron-EX W300

Asset ID: 11964

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Ulvac Corporation

Entron-EX W300

PVD (Physical Vapor Deposition)

Deposition Equipment

Equipment details:

Date of Manufacture: Apr - 2011

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Manassas, United States

Available date: 4/30/2023

Multi-Chamber Sputtering System
ENTRON-EX W300T Triple Gun Cathode Tool

Software Version : Ver. 332-A2
System Power Rating: 3 Phase,AC200V,80A/102A/63A 50/60 Hz
Loading Configuration: 3 Load Ports

Chm Position F1 PVD Sputter ( 3C ) AR , N2
Chm Position F2 PVD Sputter ( 3C ) AR , N2
Chm Position F4 PVD Sputter ( 3C ) AR , N2
Chm Position B1/B2 Degas Chambers

F1,F2,F4 - PVD Chambers ( 3C Sputter process )
B1/B2 - Degas Chambers (Remove moist layer )

System is not configured with substrate bias.
System utilizes AE MDX 1K

The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.

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