Macquarie Semiconductor and Technology on behalf of Intel Resale Corporation
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Film Thickness Measurement System
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Portland, United States
Available date: Currently Available
· Equipment Components
o FOUP loadports
§ Sinfonia Selop6 Serires
o Dual loadport wafer handler
§ Yaskawa handling system
o Operator Console with Monitor
o Computer
o AC Power Supply (Input Voltage: 208VAC/230VAC)
o Tester
§ Multiple Films measurement capabilities
· Film Thickness
· Film Reflectivity
· Index of Refraction (N or RI)
§ Stage (300mm)
§ Pattern Recognition System
· Monitor Wafer Alignment
· Site by site Alignment
· Each measurement subsystem
§ Temperature Control
· Measurement Capabilities
o 190 ~ 900Nm BBSE (Films Measurement)
o 1D Stress
o Trend Charts
· System Hardware
o 17” color monitor
o P4 Computer / Windows XP
o CD-Rom Drive
· Communications:
o Full Automation (E40, E84, E87, E90, E94)
Additional details available upon request
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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