Macquarie Semiconductor and Technology on behalf of Qorvo US, Inc.
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Date of Manufacture:
Currently Configured for: 200mm
Current Equipment Status: Available
Location of Equipment: Grand Prairie, United States
Available date: Currently Available
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================OEM Feature for reference =======================
Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm |
| Up to 12“ film frame |
| Configuration |
|---|
| Debond module |
| Clean module |
| Film frame mounter |
| Options |
|---|
| ID reading |
| Various output formats |
| High topography wafer handling |
| Warped wafer handling |
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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