Macquarie Semiconductor and Technology on behalf of Micron Technology, Inc. (Boise)
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Date of Manufacture: 2012-06-01
Currently Configured for: N/A
Current Equipment Status: Available
Location of Equipment: Boise, United States
Available date: Currently Available
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InSightTM 3DAFM is the latest generation AFM system designed to meet Critical Dimension, depth and CMP metrology requirements for 45nm and 32nm node semiconductor processes
• Lowest CD and Depth Total Measurement Uncertainty (TMU)
• Unique, Non-Destructive, 3D Metrology (LER, LWR, SWA)
• 30 wph, 9 Sites Throughput for Depth Metrology
• 12 wph, 9 Sites Throughput for CD Metrology
• Production Level Reliability and Automation
• Provides Fast Time to Data and Speeds Development Time
• Provides In-Line 3D Metrology for Gate to Improve Process Control
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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