Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)
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Etch/Ash/Clean - Plasma Processing
Date of Manufacture: 2004-11-01
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taoyuan, Taiwan
Available date: Currently Available
Tool config is based on original PO, please verify tool details at tool inspection
OEM: MTSN
Tool Model: AspenIII CIP
Software Version (include revision #): 8.0B10
System Power Rating: 208V- 3-Phase
Loading Configuration: 4 load position
Chamber Name 1: PM2
Chamber Name 2: PM3
Chamber 1 Description: (2 stage/chamber) HT type
Chamber 2 Description: (2 stage/chamber) HT type
Chamber 1 Chemicals Gases Used: PO2/PN2/4%H2N2/CF4
Chamber 2 Chemicals Gases Used: PO2/PN2/4%H2N2/CF4
Optional Gas 1: O2
Optional Gas 2: CF4
Optional Gas 3: H2/N2
Optional Gas 4: N2
Custom Gas Lines 1: O2 10SLM- AERA D980C
Custom Gas Lines 2: CF4 50SCCM - AERA D980C
Custom Gas Lines 3: 4%H2/N2 1SLM - AERA D980C
Custom Gas Lines 4: N2 2SLM - AERA D980C
Gas TOR 1: O2 10000
Gas TOR 2: CF4 50
Gas TOR 3: 4%H2N2 1000
Gas TOR 4: N2 2000
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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