Macquarie Semiconductor and Technology on behalf of Qorvo US, Inc.
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Teikoku Taping System Co., Ltd.
Date of Manufacture:
Currently Configured for: 150mm
Current Equipment Status: Available
Location of Equipment: Greensboro, United States
Available date: Currently Available
EQUIPMENT RAN GaAs MATERIAL.
Audit to verify
========= OEM Feature for reference============
Features
| ■A wafer tape mounter for wafers of 300mm.(optionally available:8inches) | ■All parameters important for attaching a wafer onto a frame can be controlled in the recipe. | ■Can be used with ultra-thin wafers.(such as shaped or reworked wafers) | ■Inline UV irradiation and BG de-taping features available.(options) | ■Longer-lasting UV lamp realized by TTS’s proprietary UV technology | ■Other optional features are available |
Specifications
| Power | AC200-240V,Single Phase |
|---|---|
| Power Consumption | 2KVA[Without UV] 3KVA[With UV] |
| Clean Air Pressure(CDA) | 0.5 – 0.6 MPa( Min Flow Rate:120NL/min) |
| Vacuum | 650 – 750mmHg( Min Flow Rate:60NL/min) |
| Nitrogen(For UV) | 0.2 – 0.4 MPa( Min Flow Rate:20NL/min) |
| Exhaust Duct Capacity | 1.0m3/min,10mmH20(100mm diameter SUS Flange duct connection) |
System Arrangement
| Dimension(WxDxHmm) | 1900×2500×1900 |
|---|---|
| Net Weight | Appx 1800Kg |
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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