Macquarie Semiconductor and Technology on behalf of Intel Resale Corporation
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Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Chandler, United States
Available date: Currently Available
Handedness: Varies
Lens Type: | 4:1, MAC real time lens control |
ChamberSet Point Temperature: | 22.2˚ C |
Altitude: (specified at order placement) | Varies by site |
Wafer Size/Type: | 300 mm notch |
300mm wafers only Carrier type | 25 wafers linked |
Prealignment Orientation: | 6:00 (Std.) |
Wafer Loader Type: | Type 4 for notched wafers |
Aerial ImageSensor (AIS) | Yes (Standard) |
Reticle Size: | 6 x 0.25 inch |
Reticle Microscope Compatibility: | 26.0 mm imaging field,57.0 mm microscope |
Ceramic WaferHolder (Chuck) | Yes (Low contact pin chuck) |
FIA with colorfilters: | Yes |
Prealignment 2: | Yes (Non contact) |
Multipoint Focus/Level | Yes |
Wafer stage | Air bearing/linear motors (Standard) |
FOUP | Yes |
FOUP load ports | 1 port |
FOUP slots | 25 slots |
FOUP opener manufacturer | TDK TAS300 Type E3 |
FOUP load/unload method | PGV with lightI/O control |
FOUP ID type | RF TAG type (TexasInstruments TIRIS RITRP-DR2B) |
FOUP ID reader/writer manufacturer | Manufacturer: HERMOS RF-ID Product Name: Transponder Reader Product# TLG-S1-1000-SO-OOEB (SECSSEMI E99.1) |
FOUP ID reader/writer control method | NSR (single wire) |
Inline: | Front Interface |
Control Rack Position | Right hand operator, Standard (Left Hand Operator optional) |
Wafer Cool Plate | Yes |
Track Vendor | TEL, Lithius |
System Computer | XP, VMS, and Linux |
Signal Tower | Yes |
Chamber Type: | Standard withAir Sampling Port (Standard) |
Amp Rack | Two piece |
BMU layout | Subfab installation |
BMU type | Mirror type |
Temperature Controller Unit | Yes |
Filters for N2, CDA for IU | Yes (Line FilterUnit LFU, non-box type) |
Filters for CDA to Stage | Yes (Line FilterUnit LFU, non-box type) |
Pellicle Particle Detector (PPD3): | Yes new PPD3 |
ETTR | No |
Projection Numerical Aperture: | Yes, Variable 0.55to Max LNA 0.815 |
Base Illumination Conditions: | |
(Conventional iNA) | Variable DOE Conventional (0.20-0.90) |
| Variable DOE Annular-3 default (Ratio 0.50-0.68) at limited INA range |
| Variable DOE Annular-2 (Ratio0.50-0.75) at limitedINA range |
Mechanical Apertures | None |
Excimer Laser | Cymer ELS 7410 |
Sub-Fab Laser Installation | Yes |
Laser Curtain Interlock Connector | Yes (Standard) |
Reticle Bar Code Reader | Yes (Nikon bar code type) |
ReticleSMIF pod RSP-150 | Yes (2 pods + internal buffer) without OHT |
SMIF loadports | 2 ports |
Reticle SMIF pod load/unload method | Operator with indicator |
ReticleSMIF pod ID type | RF TAG type (manufacturer: TI R1 TRP DR2B) |
Reticle SMIF pod ID reader/writer mfr | Asyst RFID reader |
Reticle SMIF POD ID reader/writer control method | NSR single wire |
Reticle SMIF internal buffer slots | 14 slots |
Reticle Cases: | No (Does not deliver 24 standard cases in the reticle library slots) |
Additional Reticle Cases (Quantity): | 0 |
Reticle ClampOperator Upgrade (P/N = KXA53768) | TBD – dependson site |
Operation systems software | MCSW |
| On-line (OCSW) EXECUTE exposure Laser online control PPDS3 Lot cascading |
FIA-MES, FIA-OD | |
MDC, FDC (Flexible Dose Control) | |
MG-GCM (3degree) SDM (SuperDistortion Matching)-DIMARS Align Correction (by using IDs in recipe) Shift, Linear (Ymag,Rot, Ort) cRE (Magnification) Multilayer EGA | |
Quick Reticle Change (QRC) | Yes |
Cable Configuration (May Vary): | Front in-line (Numbers in parentheses are options available from Nikon NPI.) NSR(FR) to Power Supply Module: 16 (5, 10, 20)m NSR(FR) to Amp Rack:16 (5, 10, 20)m NSR(RF) to BMU: 17.6 (13)m NSR(RR/IU) to BMU: 14.3 ( 8)m NSR(T/C) to Sub FabT/C: 15 (6, 8.4, 12)m Power Supply Module to AMP rack: 5.5 (1.5)m Power Supply Moduleto Sub Fab T/C: 20 (6, 12)m Power Supply Module to BMU: 17.9 (5, 8.4)m Beam Cover AC Servo to BMU: 14 (8)m |
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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