Macquarie Semiconductor and Technology on behalf of Micron Technology, Inc. (VA)

Applied Materials (AMAT) Centura AP AdvantEdge G5 Poly

Asset ID: 12673

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Applied Materials (AMAT)

Centura AP AdvantEdge G5 Poly

Polysilicon Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture: 2011

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Manassas, United States

Available date: 8/1/2023



[Chamber A]

Chamber type:AdvantEdge G5

Gas config.(sccm)=MFC full scale

HBR(400)/CH2F2(100)/CL2(50)/CL2(400)/

O2(10)/O2(100)/HE(400)/N2(200)/

SF6(200)/SF6(30)/CF4(300)/Ar(400)/

CHF3(400)

Source 13.56MHz, max 3000 W

Bias 13.56MHz Hz, max 1500 W

Lid Temp Control ~95℃

ESC Temp Control ~85℃


[Chamber B]

Chamber type:AdvantEdge G5

Gas config.(sccm)=MFC full scale

HBR(400)/CH2F2(100)/CL2(50)/CL2(400)/

O2(10)/O2(100)/HE(400)/N2(200)/

SF6(200)/SF6(30)/CF4(300)/Ar(400)/

CHF3(400)

Source 13.56MHz, max 3000 W

Bias 13.56MHz Hz, max 1500 W

Lid Temp Control ~95℃

ESC Temp Control ~85℃


[Chamber C]

Chamber type:AdvantEdge G5

Gas config.(sccm)=MFC full scale

HBR(400)/CH2F2(100)/CL2(50)/CL2(400)/

O2(10)/O2(100)/HE(400)/N2(200)/

SF6(200)/SF6(30)/CF4(300)/Ar(400)/

CHF3(400)

Source 13.56MHz, max 3000 W

Bias 13.56MHz Hz, max 1500 W

Lid Temp Control ~95℃

ESC Temp Control ~85℃


[Chamber D]

Chamber type:AXIOM

Gas config.(sccm)=MFC full scale

H2/N2(5000)/O2(10000)/N2(1000)

Power max 5000 W


Missing or Damaged parts: Not reported. Inspection would be recommended to confirm.

The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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