Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)

Edwards Atlas TPU+WESP

Asset ID: 211247

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Abatement - Scrubber

Support Equipment (Fab)

Equipment details:

Date of Manufacture:

Currently Configured for: N/A

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: Currently Available

Qty-3- Not overhaul

OH VendorModuleS/N

Atlas TPU

The Atlas TPU is a world proven system and the semiconductor industry's standard abatement system for CVD. In one model, there is suitability for all CVD and Etch applications, enabling World Semiconductor Council PFC emission reduction targets to be met. Each inlet can be individually configured for the highest level of abatement of all PFC gases, Fluorine (F2) or Chlorine TriFluoride (ClF3)

Technical Data

Process connections
Process gas inletsNW40 stainless steel
Bypass outletNW40 stainless steel
Abatement system exhaust outlet75 mm diameter polypropylene
Cabinet extraction outlet150 mm diameter x 150 mm deep, painted mild steel
Services connections
Nitrogen inlet1/2 inch Swagelok, stainless steel
Oxygen inlet1/4 inch Swagelok, stainless steel
Compressed dry air inlet1/4 inch Swagelok, stainless steel
Fuel gas inlet3/4 inch Swagelok, stainless steel
Cooling-water supply inlet25 mm GF union, polypropylene
Cooling-water return outlet25 mm GF union, polypropylene
Make-up water inlet25 mm GF union, polypropylene
Acid water drain outlet25 mm GF union, polypropylene
Electrical connections
Electrical supply cable leadthrough32 mm cable-gland, suitable for 5-core double insulated cable
Customer interface cable leadthroughs16 mm cable-glands
Customer interface connectionsScrew terminals
Power Requirements
Supply3-phase 400,220,208,200V, 50/60Hz
1-phase 100V, 50/60Hz
Nominal power requirements1.3kW
Mechanical Data
101.5kg (WRU E Model)
103.5kg (WRU S J Models)

Wet Electro-static Precipitator (WESP)

Edwards offers the WESP (Wet Electro-static Precipitator) for the efficient removal of particles downstream of a process chamber abatement device. The system transfers the particles into a water stream without generating significant backpressure, and can be used in conjunction with most abatement devices. Efficient removal of particles from semiconductor process exhausts minimizes the risk of blockages in exhaust ducts. WESP is well-suited for 300 mm CVD, FPD, Solar Cell and MOCVD processes.

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