Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)
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Date of Manufacture: 2014-09-12
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taoyuan, Taiwan
Available date: Currently Available
DIFFUSION 11-3HIKE_QAU_ALDNIT_01 HIKE QUIXAULT ALDSIN
Tool config is based on original PO, please verify tool details at tool inspection
OEM: HIKE
Tool Model: DJ-1236VN-DF
Software Version (include revision #): 01.58.02
System Power Rating: 110 AC 3-Phase
Loading Configuration: 5 lots Loading
General Specification
Model: Quixace Ultimate
Wafer Size: 300mm
Layout Drawing: D5CS29487
Footprint Drawing: D2CP18963
Facility Drawing: D5CP10900-2/2
Tool cable drawing: D1EF62988
Process: ALD Nitride
Gas Pattern Drawing: D7CS29874
Supporting Remote Units (Reference ONLY)
Dry Pump: iXH3030T
Abatement System Type: TBD
Abatement System Provided By: Customer
Abatement System Maker/Model: TCS
HardWare Configuration, Options
Cartridge heater: Cartridge heater RHC-2= D4EX31754
TC, Heater Control: TC for heater control
TC, Over-temperature: TC for over-temperature protection
5-P T/C, Cascade: 5-P T/C for Cascade Control
1-P T/C, Profile: 1-P T/C for Profile Control (Please refer Maintenance Items section)
Thyristor: Thyristor Unit for Heater Control
Clean Module Unit1: Clean Module Unit
Clean Module Unit2: Clean Module Unit
Clean Module Unit3: Clean Module Unit
Clean Module Unit4: Clean Module Unit
Rapid Cooling Unit
Controller
I/O SHUTTER: I/O SHUTTER
STAGE: AGV/PGV/OHT STAGE
FOUP LOADER
ROTATION FOUP STORAGE
FOUP OPENER
WAFER DETECTION
WAFER TRANSFER
WAFER PITCH CONVERTER
BOAT ELEVATOR
BOAT CHANGER
FURNACE PORT SHUTTER
BOAT ROTATION
AWTC Port: D5CP18377
FLANGE-Upper
FLANGE-Lower
HardWare Configuration, Process Kit1
Kit 1 Selection: This kit is all quartz design WITHOUT injection
Boat
Reactor Tube : Quartz Outer Tube
Adiabatic Plate: SiC Adiabatic Plate
Gas Nozzle
DIFFERENTIATING PIN
Seal Cap Plate: Quartz Seal Cap Plate
Quartz Boat Fixing Ring
Quartz Shutter Plate
HardWare Configuration, Process Kit2
Kit 2 Selection: This kit is all quartz design WITH injection
HardWare Configuration, Gas System
Gas Unit (IGS): D7VX49878
Tape Heater, Gas Pipe1:
Mass Flow Controller: SEC-Z500 series
Pressure Gauge W/SWITCH: PG/PS 1~7
Regulator: MP1,5
Regulator: MP2~4,7
Filter: F1,5,6
Filter: F2~4,7~10,12~14
Gasket filter: GF1~7
Hand valve: HV1~5,7
Hand valve: HV6
Hand valve: HV10
Needle Valve: NV1~3
Check valve: CV1,5
Check valve: CV2,3
Check valve: CV4
Air Valve: AV1,2,4,5
Air Valve: AV3,6,10,24
"Air Valve(2-3B): AV7-8,9-11,12-13,14-15,16-17,18-19,25-26,27-28
"
Air Valve(2-3B): AV20-21,22-23
HardWare Configuration, Gas System MFC
MASS Flow Controller: MFC1, N2 ,3Slm
MASS Flow Controller: MFC2, N2 ,10Slm
MASS Flow Controller: MFC3,4 , N2 ,10Slm
MASS Flow Controller: MFC5, SiH2Cl2 ,3Slm
MASS Flow Controller: MFC6.7,NH3 ,10Slm
MASS Flow Controller: MFC8, 20%F2/N2 ,20Slm
MASS Flow Controller: MFC9 , N2 ,1Slm
MASS Flow Controller: MFC10 , N2 ,5Slm
HardWare Configuration, Exhaust System
Vacuum Sensor : 1000Torr
Vacuum Sensor : 10Torr
Vacuum Sensor : 10Torr
ATM pressure sensor: PA830 102G-VCR
Main Valve: Controller
Main Valve: Valve
Exhaust Piping: D5CS11556
Exhaust Dilution Line: D5CS11558
Reactor Tube Press Leak Line: D5CS11557
"Background line: D5CS01761
NH3,DCS,%F2/N2,Gas1"
Tape Heater, Exhaust Line: N/A
Jacket Heater, Exhaust Pipe: Jacket Heater, Exhaust Pipe
Seal cap heater: Seal cap heater1
Seal cap heater: Seal cap heater2
Inlet Flange Tube Heater: D7EX40413
Inlet Flange Heater: D7EX47555
Inlet port heater: D7EX47556
Cold Trap
HardWare Configuration, Facility Interface
POWER: See Layout drawing D5CS00118-2/2, BOTTOM
GASES: See Layout drawing D5CS00118-2/2, BOTTOM
Exhaust (to duct/House): See Layout drawing D5CS00118-2/2, BOTTOM
Exhaust (to Pump): See Layout drawing D5CS00118-2/2, BOTTOM
Process Cooling Water: See Layout drawing D5CS00118-2/2, BOTTOM
UPS Requirement: Yes. Electrical connection point to main controller to tie facility supplied UPS
HardWare Configuration, LoadLock Requirements
O2 Monitor: O2 Monitor / Detector
FOUP Opener, System: FOUP Opener N2 Purge System
Load Area MFC: Loading Area MFC
Load Area N2 Purge: Loading Area N2 Purge Line
FOUP Opener, Line: FOUP Opener N2 Purge Line
Wafer Cooling N2: Wafer Cooling N2 Purge Line= N/A
Furnace Port N2: Furnace Port N2 Purge Line
Radiator: Radiator (Heat exchanger)
Filter, carbon/chemical1: Filters (carbon/chemical filter)
Filter, carbon/chemical2: Filters (carbon/chemical filter)
Filter, carbon/chemical3: Filters (ULPA filter)
Controller Interface, System
Main Operation Controller: CX5000
Main Operation Controller: CX5000
EDA Controller: SW: 01.24.00
Controller Interface, Factory
Interface-A: YES
Sub Components
Sub Operation Controller: No SW Rev
DDC Temperature Controller: SW Rev 06.03.00
Process Module Controller: SW Rev 01.12.01
Wafer Handling Controller: SW Rev 02.12.00
Controller Interface, Factory
FOUP I/O: QTY=2
FOUP ID READER: RFID on both ports
WAFER MAPPING SENSOR: F3M-S1225
FOUP PRESENCE SENSOR: E3T-ST11
SECS/GEM COMMUNICATION: SW Rev 06.01.02
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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