Macquarie Semiconductor and Technology on behalf of ON Semiconductor (SCI LLC)

Disco Hi-Tec DGP8761

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Asset ID: 228470

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Disco Hi-Tec

DGP8761

Wafer Backside Grinder

Grinding

Equipment details:

Date of Manufacture: 2023-06-01

Currently Configured for: 150mm

Current Equipment Status: Available

Location of Equipment: Bucheon, Korea, Republic of

Available date: Currently Available

Loading ConfigurationOpen Cassette  
Is System On-Line?Yes  
CE Mark Certified?Yes 
OEM Audit Available?Yes 
Can Produce Wafers AS IS?Yes 
Any Known Field Modifications?Yes
All Cables Present?Yes 
GEM/SECS Interface Yes 
SECS II InterfaceYes 
Standard Network Communication CapabilityYes  
System ConfigurationModel Type 
DTUDTU1553
Temperature controlYes
Key Common Options Included?
Clean Room ManualsYes  
Standard ManualsYes  
Machine Configuration 
UPSYes 
Main power supplyYes 
Turn table float amountYes  
Exhaust pressureYes 
Individual unit initializationYes 
Z2-axis spindle parallelism Yes 
Z2-axis inclination adjustment (on the C/T axis)Yes 
Z3-axis inclination adjustment (on the C/T axis)Yes
C/T centering and installationYes 
Performing self-grindingYes  
Z2-axis inclination (on the C/T) Yes  
Z1-axis inclination (on the C/T) Yes 
Z3-axis inclination (on the C/T)
auto setup operation (Option) Yes 
IPG origin position adjustmentYes  
NCG setup (Option)Yes  
Nozzle adjustmentYes 
T1 adjustmentYes  
T2 adjustmentYes  
Z2 Spindle Flat Position Yes 
Z2 C/T Inclination Yes 
Z2 C/T Inclination Yes 


Including DTU1550

 

1. FOUP/mapping function available or not: not supported.

2. Support for 12 inch parts or not: no 12inch parts.

3. Whether both chuck tables are 8/12 inch: 6” chuck but capable of adopting 12” chuck 

4. Whether both spindles are 8/12 inch: 12” base 

5. Z3 spindle for grind or polish: All spindles are grind and not capable of using polish on Z3 with POR condition. 

6. Presence of vacuum unit: includes vacuum pump 

7. Presence of dust collection unit: includes dust collection unit

Product images

The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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