Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)
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Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taoyuan, Taiwan
Available date: Currently Available
Process: PH3 Doped Poly/LPCVD
Tool config is based on original PO, please verify tool details at tool inspection
OEM: ASM
Tool Model: A412
Tool & Auxillary Settings
Software version: 6.80C
Heater Type: MRL
Loader configuration, 4 or 5 loader: 4
Quartzware Configuration
Outer tube: Quartz
Inner tube: Quartz
Boat: SiC boat
Boat fix ring/Cap quartz: Quartz
Adiabatic plate quantity: 6
Back N2, Qty: N/A
BCl3, Qty & Type (L-type, Straight, Diffuser, Shower): N/A
SiH4, Qty & Type (L-type, Straight, Diffuser, Shower): Multihole (1) U/D/L
O2, Qty & Type (L-type, Straight, Diffuser, Shower): Multihole (1) E
PH3, Qty & Type (L-type, Straight, Diffuser, Shower): Multihole (1) U/D/L
ClF3, Qty & Type (L-type, Straight, Diffuser, Shower): N/A
Vacuum Line configuration
Design: original config
10 Torr Baratron model: MKS
10 Torr Baratron full scale setting: 10(F/S)
1000 Torr Baratron model: MKS
1000 Torr Baratron full scale setting: 1000(F/S)
ATM sensor model: MKS
Vent Valve 1 (VV1) normally closed/open,plunger, diaphragm: Normally open,plunger
Check valve model: Fujikin
Check valve resistance pressure: 2.26 Kpa
Mainvalve type, Kitz or CKD: MKS
Slow valve, incorporated with mainvalve or separate(AV72,AV77): Separate (PV003)
Slow valve orifice size: 2.0mm (PV003)
Pressure range of vacuum gauge(Inficon Pirani gauge): 10T
Control Table
Alarm Watch/Table setting
Temp (Low Alarm Limit(deg)/High Alarm Limit(deg)/Check Time(min))
U: 0.7/0.7/30S
CU: 0.7/0.7/30S
C: 0.7/0.7/30S
CL: 0.7/0.7/30S
L: 0.7/0.7/30S
Pressure (Low Alarm Limit(Torr)/High Alarm Limit(Torr)/Check Time(S)): 0.02/0.02/30S
MFC (Low Alarm Limit(%)/High Alarm Limit(%)/Check Time(S))
MFC1: N2: 2%/2%/10sec
MFC2: N2: 2%/2%/10sec
MFC3: N2: 2%/2%/10sec
MFC4: N2: 2%/2%/10sec
MFC5 SiH4: 2%/2%/10sec
MFC6: SiH4: 2%/2%/10sec
MFC7: SiH4: 2%/2%/10sec
MFC8: 1%O2/Ar: 1%/1%/10sec
MFC9: 5%PH3/N2: 2%/2%/10sec
MFC10: 5%PH3/N2: 2%/2%/10sec
MFC11: 5%PH3/N2: 2%/2%/10sec
MFC12: ClF3: 10%/10%/10sec
Transfer Table
Wafer Charge command (charge/discharge)
Side Dummy: Upper:5 / Lower:10
Product: 100
Monitor: 5
Product & Monitor: 105
Time
2nd charge time(min): 0
wafer cool time(min): 20min
Leak Rate Table
Base pressure low Limit(Torr): 1%
Base pressure High Limit(Torr): 1%
Leak Check check time(s): 60s
Leak Check delay time(s): N/A
Leak limit(Torr): 1%
Retry Limit(count): 2
Loadlock Settings
Loadlock configuration
O2 analyser model, NGK or Toray: PBI3.1 / PBI4.0
Process
L/A Keep Value (ppm): 10ppm
N2 Flow max (L): 1300L
N2 Flow min (L): 300L
Check Stability Time(s): N/A
Ready
L/A Keep Value (ppm): 10ppm
N2 Flow max (L): 1300L
N2 Flow min (L): 300L
Check Stability Time(s): N/A
Idle
L/A Keep Value (ppm): 10ppm
N2 Flow max (L): 1300L
N2 Flow min (L): 300L
Check Stability Time(s): N/A
L/A O2 check time (min): N/A
L/A O2 limit (ppm): 10ppm
POD opener O2 limit (ppm): N/A
POD O2 check time(min): N/A
POD check retry N/A
Missing/Damaged Parts List
None report, please inspect tool to reconfirm
Dry pumps not included
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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