Macquarie Semiconductor and Technology on behalf of ON Semiconductor (SCI LLC)
The images and data contained herein is owned by Macquarie and is intended for use only by potential purchasers of goods shown herein. Except for such permitted usage, no other use of the images and data is permitted and such images and data shall not be exhibited or shown in any websites or social media or for any commercial purposes without Macquarie’s written permission. Therefore, no seller of goods like the goods shown herein has any right or authority to show or exhibit any images or data shown herein.
Etch/Ash/Clean - Plasma Processing
Date of Manufacture: 2012-07-01
Currently Configured for: 300mm
Current Equipment Status: Available
Location of Equipment: Hopewell Junction, United States
Available date: Currently Available
| Date of Audit | 7/10/2025 | ||
| Serial Number | H02110 | ||
| Chamber Serial numbers: | |||
| Chamber 1 – S03912 | |||
| Chamber 2 – S03913 | |||
| Chamber 3 – S03928 | |||
| OEM Model Number | TSP 308S | ||
| Wafer Size (inches) | 12 | ||
| Number of Cassette / FOUP Positions | 5 | ||
| Original Ship Date from TEL | 8/29/2012 | ||
| Software Version | Ver. 5.4 rev. 000 | ||
| Date of Last PM | 1/29/2023 | ||
| Is System On-Line? | Yes / No | ||
| Off-Line Date (if applicable) | 9/13/2023 | ||
| CE Mark Certified? | No | ||
| OEM Audit Available? | No | ||
| Decontamination Report Exists? | No | ||
| Can Produce Wafers AS IS? | No | ||
| Any Known Field Modifications? | No | ||
| All Cables Present? | No | ||
| Electrical Requirements | 208 – 175A | ||
| Process Chamber (P/C) 1 | Trench Etch (308) | ||
| Process Chamber (P/C) 2 | Trench Etch (308) | ||
| Signal Lamp Tower | Yes | ||
| Clean Room Manuals | No | ||
| Standard Manuals | No | ||
| Remote Service Monitors | No | ||
| Endpoint Type | SE3000 | ||
| Chamber Hardware Configuration | Present | ||
| ARDC (Advanced) | No | ||
| RDC (Radial Distribution Control) | No | ||
| DOT ESC | No | ||
| DC Superposition | No | ||
| 13MHz DC Bias | No | ||
| Chamber Hardware Configuration | Present | ||
| ESC for wafer with Dual He Cooling | No | ||
| Daihen Match Network | No | ||
| Nihon Koshuha Microwave Generator | No | ||
| Gas Lines (8 standard) | 16 | ||
| Chamber Position | Mfgr. | Model | |
| Position 1 – Lower RF | ENI | NOVA-50A | |
| Position 1 – Upper RF (SCCM) | ENI | GEW-30A | |
| Position 2 – Lower RF | ENI | NOVA-50A | |
| Position 2 – Upper RF (SCCM) | ENI | GEW-30A | |
| Etch Chamber Pump | |||
| Manufacturer | Edwards | ||
| Model | IH600 | ||
| Quantity Required | 2 | ||
| Included With System | No | ||
| Load Lock Pump | |||
| Manufacturer | X | ||
| Model | X | ||
| Included With System | No | ||
| Transfer Chamber Pump | |||
| Manufacturer | Edwards | ||
| Model | EPX 180LE | ||
| Included With System | Yes | ||
| Chiller | |||
| Manufacturer | Komatsu | ||
| Model | FRV 6000-6 | ||
| Quantity Required | 1 | ||
| Included With System | No | ||
| Gas Line # | Gas | Flow (sccm) | MFC Mfgr. |
| 1 | HBr | 1600 | Fujikin |
| 2 | NF3 | 1600 | Fujikin |
| 3 | NF3 | 160 | Fujikin |
| 4 | NF3 | 20 | Fujikin |
| 5 | SiF4 | 100 | Fujikin |
| 6 | SF6 | 110 | Fujikin |
| 7 | O2 | 100 | Fujikin |
| 8 | O2 | 10 | Fujikin |
| 9 | X | X | X |
| 10 | X | X | X |
| 11 | Ar | 1300 | Fujikin |
| 12 | O2 | 1000 | Fujikin |
| 13 | X | X | X |
| 14 | X | X | X |
| 15 | X | X | X |
| 16 | X | X | X |
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
Get in touch
Ask about our equipment solutions, ranging from Macquarie equipment inventory sales, sourcing programs, surplus disposition options, and direct equipment purchases.