Macquarie Semiconductor and Technology on behalf of Intel Ireland Ltd.
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PECVD (Chemical Vapor Deposition)
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Leixlip, Ireland
Available date: Currently Available
BASE MODEL - STANDARD FEATURES
- Remote Interconnect Cable Lengths: 75ft / 22.9m cables (default)
- Facilities Configuration: Bottom Facilities Installation
- Factory Automation Communication Interface (AGV or OHT interface)
- FOUP ID Reader
- 2-FOUP Front End
- Vacuum end effector
- Process Module Options:
- Leak-Check Shutoff Valve for Process Module
- Documentation
- One (1) set of CD ROM manuals
- Customer Engineering Specials and/or additional items
- CESCVD44058A,FRONT DOOR, UPPER
- Cooling system (blowers)
- Communication cables, subfab to tool
- Software 5.32
- RF detectors
- In situ UV intensity - In situ UV monitor to be retrofit on first two systems
SOLA UV THERMAL PROCESSING (UVTP) System Incorporates 3QOrnm wafer handling and a four (4) station process module to provide high throughput thermally assisted UV treatment of Dielectric PECVD and other films. The system offers continuous wafer processing with full factory automation capability and includes the following features plus the no charge configuration selections:
- Dual FOUP configuration
- Atmospheric Robot in an enclosed mini-environment with Class 1 HEPA filter Single wafer load-locks with integrated wafer transport and cooling
- One on-board load-lock vacuum pump - Two loadlock pumps on first two systems, CIP to move to one LL pump prior to first VF shipment
- Automatic wafer centering for OTF positioning of wafers entering inbound loadlock
- One four-station UV Thermal Process Module with flexible illumination lamp configuration
o Four (4) broad-spectrum UV illuminator modules, each containing two (2) magnetron excited hi- intensity UV lamps
o Eight (8) channel ultraclean gas panel
o Inert Gas UV Window Purge at each station
o Integrated backside non-contact wafer temperature sensor
o Integrated UV intensity monitor
o Integrated local power box
o Proteus software with primary user interface
o SECS/GEM Software
o Hazardous Process Material (HPM) Detector Interface
o Facilities Gas Interlock'
o Complies with SEMI S2 and CE marking requirements
o Process Vacuum Pump Package Electrical Interface
o F47 Compliant
o UPS Ready
BACK END CONFIGURATION FEATURES
- SYS,C3SOLA,INTEL BEOL
- GSBX,C3SOLA,9,STD
- CBL ASSY,AC PWR,UI COMP,VCTR
- KIT,E84 COMPATABILITY,VCTR
- KIT,LT TWRS,USR&CHASE,3CLR
- KIT,2 FOUP F/E STD W/RFID,VECTOR
- KIT,SYSTEM LABELS,C3SOLA
- KIT,FACIL I/FACE,BTM EXIT,C3SOLA
- KIT,LOAD LOCK,IMM/F47,C3SOLA
- KIT,PURGE BAFFLES,WINDOW,NON-RPC,HSN
- KIT,GAS DIST,PURGE,TOP PLT,HSN
- KIT,RESTRICTORS,PURGE LINES,TOP PL,C3SOLA
- SYS PNL KIT,INTEL VECTOR,C3VCTR
- KIT,NON-RPC,C3SOLA
- INSTALL KIT,OPTIC HARDWARE,C3SOLA,+10-10 RR
- KIT,COMMUNICATION,LAMP PWR SUPPLIES,W/IO BOARDS
- CABLE KIT,RMT INTCON,75FT,HIPRES,C3SOLA
- KIT,UV POWER SUPPLY RACK KIT,C3SOLA
- KIT,PWR DIST,STD PED,HIPRES BLWRS,C3SOLA
- KIT,ATM ROBOT,2 FOUP,INTEL SOLA
- SHIPPING KIT,C3SOLA,INTEL
- KIT,CONFIGURATION,C3SOLA,INTEL
- KIT,SEKIDENKO,INTEL BEOL
- LOADER,FOUP,STD CONFIG W/HERMOS,6M
FRONT END CONFIGURATION FEATURES
- SYS,C3SOLA,INTEL FEOL
- GSBX,C3SOLA,9,STD
- CBL ASSY,AC PWR,UI COMP,VCTR
- KIT,E84 COMPATABILITY,VCTR
- KIT,LT TWRS,USR&CHASE,3CLR
- KIT,2 FOUP F/E STD W/RFID,VECTOR
- KIT,SYSTEM LABELS,C3SOLA
- KIT,FACIL I/FACE,BTM EXIT,C3SOLA
- KIT,LOAD LOCK,IMM/F47,C3SOLA
- KIT,PURGE BAFFLES,WINDOW,NON-RPC,HSN
- KIT,GAS DIST,PURGE,TOP PLT,HSN
- KIT,RESTRICTORS,PURGE LINES,TOP PL,C3SOLA
- SYS PNL KIT,INTEL VECTOR,C3VCTR
- KIT,NON-RPC,C3SOLA
- INSTALL KIT,OPTIC HARDWARE,C3SOLA,+10-10 RR
- KIT,COMMUNICATION,LAMP PWR SUPPLIES,W/IO BOARDS
- CABLE KIT,RMT INTCON,75FT,HIPRES,C3SOLA
- KIT,UV POWER SUPPLY RACK KIT,C3SOLA
- KIT,ATM ROBOT,2 FOUP,INTEL SOLA
- KIT,PWR DIST,CERAMIC PEDS,C3SOLA
- KIT,CONFIGURATION,C3SOLA,INTEL
- LOADER,FOUP,STD CONFIG W/HERMOS,6M
OTHER ITEMS:
- Include Ergonomics Upgrades if not standard
- Include EU Directive Features if not standard
- FE option (400-550C operation option with ceramic pedestals, without in situ temperature monitor)
- RPC (Remote Plasma Clean) – Not Approved for HVM
- Includes Latest Approved SW Revision
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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