Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (F16)
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Centura AP DPS AdvantEdge G2 Metal
Etch/Ash/Clean - Plasma Processing
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: 6/5/2026
Tool config is based on original PO, please verify tool details at tool inspection
OEM: AMAT
Tool Model: DPS II ADVANTEDGE
Software Version (include revision): B3.5_105
System Power Rating: 208 AC 3-Phase
Loading Configuration: 3 LOAD PORT
Chamber Name 1: A
Chamber Name 2: B
Chamber Name 3: C
Chamber Name 4: D
Chamber 1 Description: DPSII
Chamber 2 Description: DPSII
Chamber 3 Description: DPSII
Chamber 1 Chemicals Gases Used: BCL3/CL2_50/CL2_400/HE/O2_50/N2/O2_200/SF6_200/HBR/CHF3/CF4/AR
Chamber 2 Chemicals Gases Used: BCL3/CL2_50/CL2_400/HE/O2_50/N2/O2_200/SF6_200/HBR/CHF3/CF4/AR
Chamber 3 Chemicals Gases Used: BCL3/CL2_50/CL2_400/HE/O2_50/N2/O2_200/SF6_200/HBR/CHF3/CF4/AR
Chamber 4 Chemicals Gases Used: O2/CF4/N2
OEM Cable 1: Monitor 1 cable length
OEM Cable 2: Monitor 2 cable length
OEM Cable 3: HX Controller Cable length
OEM Cable Length 1: 22860
OEM Cable Length 2: 22860
OEM Cable Length 3: 22860
N2 Load Port Exists 1: Yes
N2 Load port Vendor 1: Justem
N2 OEM Stage Available 1: Yes
N2 Load Port Exists 2: Yes
N2 Load port Vendor 2: Justem
N2 OEM Stage Available 2: Yes
N2 Load Port Exists 3: Yes
N2 Load port Vendor 3: Justem
N2 OEM Stage Available 3: Yes
| System Configuration | ||
| Description | ||
| Tool: | ||
| Process Unit: | Model: | Qty |
| Main body(FI) | 5.3 FI | 1 |
| Main body(M/F) | Centura AP | 1 |
| Main body(ChA G2 ) | DPS II ADVANTEDGE | 1 |
| Main body(ChB G2) | DPS II ADVANTEDGE | 1 |
| Main body(ChC G2) | DPS II ADVANTEDGE | 1 |
| Main body(ChC ASPII) | ASP II | 1 |
| AC Rack | 1 | |
| Cathode SMC Chiller | SMC Chiller :INR-496-003D | 3 |
| Wall SMC Chiller | SMC Chiller:INR-498-016C | 2 |
| Controller: | ||
| FI server | 306M | 1 |
| FE server | 306M | 1 |
| MF server | CL7 | 1 |
| Temperature Controller | 2 | |
| Main Operation Unit | Flat Panel with Keyboard on Stand | 1 |
| Chamber control module | 4 | |
| MFC/ Pressure Unit | 4 | |
| EV Module | 5 | |
| Drive Mechanisms: | ||
| FOUP Opener: | ||
| Gas System: | ||
| Exhuast System: | ||
| Turbo pump (ETCH Chamber ) | A/B:Cheng-Hui Advanced / STP-XA2703CV ; C:SHIMADZU / NZJ278 | 3 |
| Pressure sensor (10 Torr) | 4 | |
| Rough valve | 3 | |
| Power system: | ||
| Source generator | GEN RF 13.56MHZ 3KW APEX 3013 3 PHASEREP | 3 |
| Bias generator | GEN RF 13.56MHZ 1.5KW APEX 1513 3 PHASE | 3 |
| source match | RF MATCH,13.56MHZ, 8 KVP,85 A | 3 |
| Bias match | RF MATCH,13.56 MHZ, 3KV, 35 A | 3 |
| Transfer system : | ||
| Mainframe Robot | VHP with Dual blade | 1 |
| Mainframe Robot blade material | Ceramic | 2 |
| Atmospheric Robot | KAWASAKI / A321-271-306 | 1 |
| Factory Interface system : | ||
| Wafer Storage | Right Side Storage Pod | 1 |
| Wafer Storage | Left Side Storage Pod | 1 |
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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