ASML TWINSCAN XT:400F

Equipment details:

Date of Manufacture:

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: Currently Available

Description:

Tool config is based on original PO, please verify tool details at tool inspection

Software Version: 4.1.0

System Power Rating: 400V5W-U

Configuration Items 

  Track Pre-warning signal (APR): APR enabled

  Avoid Track INPUT/OUTPUT conflicts, Raise AS after APR: Avoid Track INPUT/OUTPUT conflicts enabled

  Active wafer release for dry WS: FALSE

  Closing disk type: No closing disk present

  Safeguard to prevent loading of reticles with too wide or mispositioned pellicles: Disabled

  Continuous clampable wafer table for dry WS: Absent

  Type of wafertable on chuck 2 for immersion machine: Zerodur version 1

  Type of wafertable on chuck 1 for immersion machine: Zerodur version 1

  WS Immersion throughput package: None

  WS Immersion thermal control package: None

  extended docking interface at Prealigner: ECC_0MM

  Wafer Stage Configuration: Wafer Stage type 3 configuration

  Wafer Carrier Location: Right

  Wafers per Carrier: 25

  Wafer Mark Sensor: Absent

  Wafer Id Reader: Absent

  Wafer Size: 300mm

  Wafer Track: Present

  Wafer Stage Type: Dual Chuck

  Wafer Stress Relaxation: FALSE

  Lower Docking Plate: Present

  WS Balance Mass: Stainless Steel

  WH Robot Power Amplifier: CPM 20

  Wafer Stage Fast Stiff X Move Electronics: Present

  Wafer Stage Mirror Block Down Electronics: Absent

  Universal Prealignment: Disabled

  Interferometer axis version at exposure: 3 plus 1 axis

  Wafer Handling Pneumatics: Standard

  Wafer Switch: Absent

  Chuck 1 wafer size: 300mm

  Chuck 2 wafer size: 300mm

  Type of immersion hood for immersion: None

  Specifies chuck1 layout relev. for Immersion: Chuck does not support immersion

  Specifies chuck2 layout relev. for Immersion: Chuck does not support immersion

  Specifies chuck1 config: Dry

  Specifies chuck2 config: Dry

  Specifies chuck1 version: not specified

  Specifies chuck2 version: not specified

  Changed Short Stroke diff XY controller: Disabled

  Docking wheels at WH unload: Absent

  Docking plate height: Low

  Immersion Hood version: Absent

  Carrier Handler Type: Mark II 300 Foup

  Wafer Handling Load Robot Type: Double Fold Arm, 12 mm Z stroke

  Wafer Handling Unload Robot Type: Double Fold Arm, 12 mm Z stroke

  Wafer Handling Store Unit: Absent

  Wafer Handler wrt BF Shifted in Z: Not Shifted

  Integrated Reticle Inspection System Clipped Status: PPD2_1 System;

  Reticle streaming lite: Disabled

  Enhancements in Reticle Monitor: no enhancements

  Reticle streaming: Disabled

  Improvements for reticle handling: Disabled

  Extend IRIS maximum particles scanned to 50000.: Absent

  Zeroing type for Encoders Measurement System: Using reference marks on the encoder scales

  Reticle Stage Chuck Type: Magn. Grav. Comp. Changed Lens Top

  Reticle Stage Chuck Type: TYPE_4

  Nitrogen purging of Reticle Stage: RS is not purged

  Reticle Carrier Location: Right

  Integrated Reticle Inspection System: PPD1 with IRIS1 functionality.

  Integrated Reticle Library: IRL with original functionality

  Reticle Size: 6 inch

  Reticle Carrier Tag Reader: Present

  Reticle Stage Long Stroke Motor Type: Cobalt Ferro 18 teeth

  Reticle Stage Long Stroke Config: TYPE_5

  Automated Reticle Transport System: Absent

  Reticle Stage Lenscooler Box: Lenscooler Box with anti-aliasing Filter

  Maximum Reticle ID Length: 24 Characters

  Reticle Stage Measurement System on Scan: Heidenhain Encoders

  Relative direction of ws to rs on the X axis: Same

  RS Object Field: Normal

  Reticle exchange type: Retex option

  Iris feature Scan: Absent

  Reticle Handler type: RH Mark III

  2D Barcode Reader: Absent

  Integrated Reticle Inspection System Configuration.: Disable creation of OSIRIS viewable files.

  Settle time reduction to improve the throughput: Don't care

  Scan speed increase to improve the throughput: Don't care

  WS Immersion Hood Only Testrig: Absent

  Version of RS/WS IO library: Version 1

  Dynamic Performance Calculation: Mark 1

  Stages Sample Rate: 5.0 kHz

  Interferometer Electronics: Ifsr

  Capacitive z-height sensor type.: Extended Z sensor board

  Ifm config at measure side.: 7 axes

  UV Shutter Optimized Open Time: Optimized UV Shutter Open Time V2

  DoseSystemPerformanceTest sequence: Test sequence 0

  PEP-ADC Intensity: Disable PEP-ADC Intensity;

  Online Lamp Peak: Disable Online Lamp Peak;

  Dose Intensity Optimization: Disable Dose Intensity Optimization;

  Laser Gas Life eXtension: Disable Laser Gas Life eXtension;

  Type of multi foil lens element: none

  Depolarizer type: not applicable

  PSE Location: not applicable

  PCE Location: not applicable

  Intensity Calibration Per DOE: Disabled

  Pupil qualification method: Centre of gravity method

  Polarized illumination amorph DOE.: Only unpolarized illumination.

  Fresnel corrections for WSSS: Disabled

  Is NA accuracy measurement allowed?: Disabled

  Exchangeable Pupil Lens Element: No EPLE

  Multifunction Active Lens Element: 0

  Multifunctional Active Elements: 0

  Use Sigma Calibration: no Sigma Calibration

  Use Sigma WIP Preserving Offsets: no Sigma WIP Preserving Offsets

  THFFC FDE model lens dependent: Disabled

  BALE Type: Don't Care

  TIS diffuser: TIS diffuser absent

  Determination of NA ellipticity: Disabled

  XML output for LITHOGUIDE: Disabled

  Use validity ranges around UIP data when Enabled.: Use exact matching for UIP data

  Number of EXLE elements: 0

  Functional use of Active Elements: No AE element

  Polarization Shaping Element Retractor: No PSER hardware installed in the machine

  Method for alignment of the laser beam: Not applicable for UV systems

  Pupil TIS angular sensitivity calibration and correction: TIS Pupil Measurement will not be improved

  Describes at what plane the BMU measures: Not applicable for uv systems

  Lens Type: 41

  Light-source Architecture: HG Lamp

  Light-source Type: Lamp

  Light-source Wave-length: 365nm

  DOSEMAPPER: Absent

  DOSE_MAPPER_1: Absent

  REMA architecture: REMA C

  Illuminator Type: 39

  Zoom Axicon Architecture: ZA

  Zoom Axicon Type: 39

  NA Control Architecture: NA2 Torlon

  NA Control Type: 39

  Automated DOE Exchanger: Absent

  Automated DOE Exchanger Architecture: 5 slots MIP Control

  UNICOM: Absent

  UNICOM Architecture: 1 Motor

  Test Table: Absent

  Imaging Electronics Architecture: B Architecture

  Attenuator Type: Discrete 16 Transmissions

  Test Table Z Axis: Worm Wheel

  PUPICOM: Absent

  PUPICOM Architecture: DC Motor

  Number of Z Lens Manipulators: 2

  Number of Active Lens Elements: 0

  Number of Bi-directional Active Lens Elements: 0

  Number of Active Manipulator Elements: 0

  Number of Active Elements: 0

  Number of Half Dome Mirrors: 0

  Number of Semi-Active X-Y Lens Manipulators: 0

  Setup sensor board version: Setup SSD not available

  Imaging Generic Power Amplifier: Ten Axis Power Amplifier

  Imaging Control Rack Configuration: IMCR

  Type of projection multiplexer board: MUX Absent

  LEC Rack in Electronic Architecture: Absent

  Projection GPA Configuration Version: Version 2

  Number of Lens NEXZ Manipulators: 0

  Number of Lens Z Manipulators Using Camdisk: 2

  Spotsensor surface coating: Metacolor

  Energy Sensor: CrismaTec

  Spot Sensor Chuck 1: CrismaTec

  Spot Sensor Chuck 2: CrismaTec

  Modelling for MAXYS: Absent

  Uniformity Improvement Package: Absent

  Number of pre-amps available per Z-manipulator: 1

  Immersion: Absent

  Pupil measurements with ILIAS: Absent ( Overrules Absent )

  Automatic CUA: Absent

  Beam Control: None

  Extended Spot Sensor Matching: Absent

  Number of Rxm: 0

  Number of Rym: 0

  Diaphragm Limiter: Absent

  NA1 motor type: None

  Spot Sensor Reticle Stage: Absent

  Smooth Field Uniformity: Absent

  Exchangeable Last Lens Element: Absent

  Exchangeable Pupil Lens Element: Absent

  Number of manipulable ELLE axes: 0

  UV Shutter version: UV Shutter version 3

  Dosecontrol Hardware: ISB

  Illuminator platform: Aerial 1

  Polarization: Absent

  Automatic PCE exchanger: Absent

  Automatic CUA exchanger architecture: Not applicable

  Test table architecture: Aerial 2

  Illumination modes: All illumination modes

  DUV Lightsource Power Level: Not applicable

  Lens Top Tool Connection: Lens Top Tool can be mounted on top of the Lens

  Scanning Energy Sensor Calibration: Static Energy Sensor Calibration

  Position of Spot Sensor on Chuck 1: Spot Sensor Position on Chuck 1 layout 1

  Position of Spot Sensor on Chuck 2: Spot Sensor Position on Chuck 2 layout 1

  Z-capture for low relfectivity wafers: Off

  TIS plate deformation correction: Disabled

  FSM Flexibility package: Disabled

  Field width optimised leveling: Disabled

  Constrained fit: Disabled

  Levelling throughput improvement on measure side: No levelling throughput package

  Point-to-Point LS Machine Matching: Disabled

  Circuit Dependent FEC: Absent

  Focus Monitoring: Present

  Extended LS areas: Disabled

  Air Gauge: Absent

  Type of Air Gauge: No Air Gauge device present

  Reticle shape correction: Disabled

  LS focus node: LS focus node 1

  Level Sensor Processing Rack: MPCR

  LS_PEMM_CONFIG: Present

  LS_CPU_CONFIG: 2 CPU's available

  BaseLiner overlay high order intrafield: BaseLiner-Overlay high order intrafield is disabled.

  BaseLiner focus high order intrafield: BaseLiner-Focus high order intrafield is disabled.

  BaseLiner focus control.: BaseLiner-Focus application is disabled.

  BaseLiner overlay control.: BaseLiner-Overlay application is disabled.

  Pattern Matcher fullchip: Absent

  Pattern Matcher: Absent

  Maximum numerical aperature (NA) that can be used in Lot Production: level 0

  Log missed translations: Disabled

  Allow even orders usage: Absent

  Multilingual UI: Absent

  Improved Maintenance action scheduling.: Disabled

  Recipe Creator: Light

  Lot Report Data Category: Enhanced Diagnostics

  CDC: Enabled

  EFESE: Absent

  PED control mode: Absent

  Proximity Matching: Absent

  mbds control: Present

  Enhanced exposures 1: Absent

  Data collection not covered by FOCUS and OVERLAY: InformPro Data Collection disabled.

  Overlay Data Collection: Overlay Data Collection disabled.

  XML Lot Report Content Level: Basic

  Enable the Maintenance Assistant: Disable Maintenance Assistant

  EDA Interface: Disabled

  Equipment Constants via SECS interface: Enabled

  LCI WaitWatcher plug-in: Absent

  Reorder Lot Service: Present

  Shot Data Collection: Present

  Focus Data Collection: Absent

  Alignment Recipe Override: Alignment Recipe Override Disabled

  Alignment Strategy ID Standard or Extended. Protected.: Alignment Strategy ID max length is 15 characters

  Enable to support SMASH XY mark types.: SMASH XY marks are not supported.

  Specifies which mark types are supported: ASML marks only

  Alignment laser configuration: 2 color laser

  OADB Improved Dynamic Range: Disabled

  board configuration: ODB + ADB

  Alignment Camera Mirror: Absent

  Athena Narrow Marks Twinscan: Present

  Alignment Sensor Type: Athena Narrow Marks OM

  Athena Focus Improvements 1: Absent

  Max alignment speed: Setting 2

  AA processing rack: MPCR processing rack

  Particle Extraction Mass Flow Meter: Absent

  purging configuration: purging CONFIG 1

  Bubble Extraction Seal Setting: Not Applicable

  Ultra Pure Water flow controller (WICC): absent

  LCW Circuit set-up: Flow Version 1

  In situ Wafer Table: Stone Cleaning

  Clean Air Configuration: Others

  Metroframe Circuit Water Cabinet: Absent

  CT Miscellaneous Rack: Present

  Clean Air Temperature Control: Driver and ACC

  Purge Hoods configuration: Absent

  Nitrogen Purge Utility Control: Absent

  Reticle Cleaning: Absent

  Metroframe type: TYPE_A

  Inlet restriction for clean air: Absent

  Reticle Stage purged mini environment: Absent

  Gas Control Unit Type: High Flow (HF)

  Wet Imaging Control Cabinet: Not Applicable

  Readout location of Pneumatic Facility Unit sensors: CT sensor board (CTS)

  Laminar Bottom Hood: Absent

  Extreme Clean Humiditied Air: Absent

  Lens Circuit Water Flow: Normal

  Motor Circuit Water Flow: Normal

  SPM temp correction for lens axis: Disabled

  2 Sided IFM-beams for WS-X (expose): Not available

  2 Sided IFM-beams for WS-X (measure): Not available

  Diff pressure correction for IFM beams: Absent

  IFM Laser Configuration: AOM Recombo Laser

  Position Control Rack Configuration: Rack Configuration type 3

  Position Control Power Rack Configuration: TYPE_4

  Number of Motion Controllers: 5 Motion Controllers present

  Position Control Motion Control rack: MPCR

  Reticle Stage Short Stroke X amp.: PADC 100V/18A

  Reticle Stage Short Stroke Y11 amp.: PADC 100V/18A

  Reticle Stage Short Stroke Y12 amp.: PADC 100V/18A

  Reticle Stage Short Stroke Y21 amp.: PADC 100V/18A

  Reticle Stage Short Stroke Y22 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 1 XY1 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 1 XY2 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 1 XY3 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 2 XY1 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 2 XY2 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 2 XY3 amp.: PADC 100V/18A

  Reticle Stage Short Stroke Z1 amp.: PADC 100V/18A

  Reticle Stage Short Stroke Z2 amp.: PADC 100V/18A

  Reticle Stage Short Stroke Z3 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 1 Z1 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 1 Z2 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 1 Z3 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 2 Z1 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 2 Z2 amp.: PADC 100V/18A

  Wafer Stage Short Stroke 2 Z3 amp.: PADC 100V/18A

  Reticle Stage Long Stroke Y11 amp.: 450V20A

  Reticle Stage Long Stroke Y12 amp.: 450V20A

  Reticle Stage Long Stroke Y21 amp.: 450V20A

  Reticle Stage Long Stroke Y22 amp.: 450V20A

  Reticle Balance Mass 1 amp.: 450V20A

  Reticle Balance Mass 2 amp.: 450V20A

  Wafer Stage Long Stroke E X amp.: 450V20A

  Wafer Stage Long Stroke M X amp.: 450V20A

  Wafer Stage Long Stroke E Y1 amp.: 450V20A

  Wafer Stage Long Stroke E Y2 amp.: 450V20A

  Wafer Stage Long Stroke E CS amp.: 450V20A

  Wafer Stage Long Stroke M Y1 amp.: 450V20A

  Wafer Stage Long Stroke M Y2 amp.: 450V20A

  Wafer Stage Long Stroke M CS amp.: 450V20A

  Wafer Stage Balance Mass 11 amp.: Don't care

  Wafer Stage Balance Mass 12 amp.: Don't care

  Wafer Stage Balance Mass 21 amp.: Don't care

  Wafer Stage Balance Mass 22 amp.: Don't care

  Pressure update rate for fringelength correction: Pressure update rate 2 or 4 Hz

  TestStream: TestStream disabled

  Performance Enhancement Package: 1

  PEP Image Streaming: Absent

  Lot Overhead Reduction: LOR2

  PDOC quality indicator check: PDOC quality indicator functionality is absent

  Combined stage alignment: Disabled

  Reduced capture range for TIS scans: Disable reduced range TIS scan scenarios

  Extended Zone Alignment: Disabled

  Intrafield Higher Order Process Corrections: Disabled

  SMASH Reuse Capture Information in Stage Alignment: Coarse capture scans are done on all stage alignment marks.

  Allow wafer plane deviation check with Focus Monitoring: Disabled

  Parameter indicates how long overlay data will be stored.: Short retention period.

  Level sensor Ry drift correction: Disabled

  Fading Control Switch: Disabled

  Improved wafer reject mode: Disabled

  Automated Lens Heating Calibration: Disabled

  Lens heating History in LH Feedforward: Disabled

  Allow different Exp,TIS Align set: Absent

  Imaging Fading Control: Disabled

  Gridmapper: Disabled

  2D grid correction: Disabled

  Double TIS scan: Disabled

  Symmetrical Reticle Alignment: Disabled

  Ast offset correction in TIS LHFB/LOCO (Version 3): Enabled

  Choice of avoidance routing.: Absent

  NEXZ-tilt per exposure: The NEXZ-tilt cannot be adjusted per exposure.

  Off-axis slit: Projection lens has no off-axis slit.

  Improved Edge Field Leveling: Disabled

  Enhanced Throughput Reticle Alignment: Present

  Wavelength Adjustable: Fixed

  Allow L1L7 Type 1 Optimization: Absent

  Lot Alignment Report Encryption: Unencrypted

  Stage Alignment Filter: Absent

  Lot Correction Sequence: Type B

  Lens Heating Feedback: Absent

  Application Specific Lens Heating Calibration and Verification: Present

  Improved Contrast Control: Absent

  ILIAS lens setup: Absent

  Air Gauge Improved Levelling: Absent

  Process Dependent Gain Correction: Absent

  Enhanced Exposure Overlay: Absent

  ALE 1 Use: Lens heating only

  Overlay Node: Level 5

  E-chuck Flatness Qualification Test: Disabled

  TOP HD: Absent

  Reticle Align High Precision: Absent

  LS spot coverage: Absent

  Layout Version Number TIS Plate 1 on Chuck 1: TIS Plate 1 Layout Version 4

  Layout Version Number TIS Plate 1 on Chuck 2: TIS Plate 1 Layout Version 4

  Layout Version Number TIS Plate 2 on Chuck 1: TIS Plate 2 Layout Version 4

  Layout Version Number TIS Plate 2 on Chuck 2: TIS Plate 2 Layout Version 4

  Usage of wavelength data by TIS: Disabled

  Usage of Energy Sensor data by TIS: Disabled

  Indication what kind of AM controller hardware is present: SUCR

  Piezo Active Lens Mounts: Absent

  ILIAS Functionality For Lithoguide: Absent

  ISIS Functionality For Lithoguide: Absent

  SAMOS Stray Light Test For Lithoguide: Absent

  PUPIL Measurement For Lithoguide: Absent

  FOCAL Measurement for Lithoguide: Absent

  Leveling Verification Test for Lithoguide: Absent

  Lithoguide Imaging Recipes: Absent

  Dose System Performance Test for Lithoguide: Absent

  ILIAS Sensor Location: Absent

  ILIAS sensor type chuck 2: Zernike only

  ILIAS sensor type chuck 1: None

  Reticle Level Polarization Sensor: Absent

  Improve robustness DPCM mark: Disable DPCM mark robustness improvement

  SASO robustness and fiber connectivity: Disable SASO robustness

  Extended X width masking range: Disabled

  PDO offset for EFL LS spots: Disabled.

  Assure System Snapshots: Assure System Snapshots not allowed

  Insert a delay time before starting a Lot (lens heating).: Disabled

  Save throughput data to the disk: Disabled

  Patch strategy: Patchlevel

  Chuck Dedication: Basic

  Application Type: Scanner Application

  Number of RMCS clients: No clients

  MDL Viewer: Site View

  ZERO Fiducial: ILIAS

  Machine Architecture: XT Machine Architecture

  XT Architecture Revision: Rev2

  Machine Type: 400

  Machine Specification: F Specification

  Stand-alone Workstation: FALSE

  Machine Location: Customer Site

  CP 1A: Present

  CP 1B: Absent

  CP 2: Present

  CP 3: Present

  CP 4: Present

  CP 5: Absent

  CP 6: Absent

  Wafer Handler Productivity: Wafer Handler Productivity Level 1

PM record- 2025-12-18 

Open Myequip and complete Blueprint Checklist: YES

Close VNC: OK

CoHE/LOTO check: OK

Dose Accuracy Repeatability (ODAR) Repeatability 0.7%: 0.7

Dose Accuracy Repeatability (ODAR) Accuracy 2%: 2

Wafer Stage Air bearing Check (SWCA): OK

Water Cabinets Fill Procedure: OK

Wafer Stage Critical Checks and Clean Procedure: OK

Wafer Stage V-Grooves and Locking Pins Grease Procedure: OK

Fast Tools Rebuild and DP Stores Clear Procedure: OK

BMWL Test Procedure: OK

Reticle Stage Scale Maps & Scan Tilts(GISM) wr, Linear Roll [urad/m] -25 ~ 25: 25

Reticle Stage Scale Maps & Scan Tilts GISM) wl, Linear Wedge [urad] -1 ~ 1: 1

Reticle Stage Scale Maps & Scan Tilts(GISM) wq, Quadratic Wedge [urad/m] -25 ~ 25: 25

Reticle Stage Scale Maps & Scan Tilts(GISM) yTx map, observe range y=[-66mm, +66mm], largest delta -4 ~ 4: 4

Reticle Stage Scale Maps & Scan Tilts (GISM) yRz map, observe range y=[-66mm, +66mm], largest delta -0.080 ~ 0.080: 0.08

Stages Performance Test on the Reticle Stage and Wafer Stage (TSPE): OK

Illumination performance data collection/SLIT UNIFORMITY AND INTENSITY Average Spot Sensor Light Intensity [ mW/cm2] >5000: 6000

Illumination performance data collection/SLIT UNIFORMITY AND INTENSITY Slit Uniformity, Annular [%] < 2%: 2

Alignment performance check/Calibrate Alignment Shift Between Orthers Result Summary, Max 1st 3SD < 2.8: 2.8

Alignment performance check/Calibrate Alignment Shift Between Orthers Result Summary, Max 2-7 3SD < 1.6: 1.6

TSU Height Check: OK

Environment Check/Tool and environment 6S check: OK

Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales