Cohu, Inc. Rasco Jaguar

Equipment details:

Date of Manufacture:

Currently Configured for: N/A

Current Equipment Status: Available

Location of Equipment: Heredia, Costa Rica

Available date: Currently Available

Audit to verify

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High Performance Strip Handler

Jaguar is designed for high-volume production testing of ICs on a strip format or in device carrier. It is fully automotive qualified for tri-temperature test and the ideal solution for high parallel testing of small packages at short test times, but also for power and sensor devices.

The system features a precise, forceless contacting solution to ensure integrity of delicate bare die and ceramic substrates.

The handler is designed to operate stand alone or in-line with other product equipment, testing each layer on a multi-die 3D stack process. Additionally, Jaguar can be configured for high parallelism full flux or thermography test of lead-frame and tile LEDs, or integrated with various MEMS modules for cost-effective testing of magnetic, pressure, acoustic and optical sensors.

Wide package range; Leaded and leadless. Ability to handle all common types of strip and different type of strip input and output.

Due to the integrated vision alignment and high precision linear motors, Jaguar provides high yield and excellent OEE.

Performance Characteristics

• Strip index time down to 2.0 sec

• Device index time down to 0.18 sec

• MTBF: > 1,000 hr, MTTR: < 30 min, MTBA: > 4 hr

• Jam Rate < 1: 1,000 strips

Strip Dimensions

• Length: 76.2 mm to 300 mm

• Width: 25.4 mm to 102 mm

• Thickness: 1.0 mm (max.)

• Body height: 6 mm (max.)

• Devices per strip: 5,000 (max.)

• Strip warpage: ≤ 7 mm (max.)

Temperature Characteristics

• Range: ‐45°C to +160°C

• Accuracy: ±2°C

• Time to temp1: 30 min (typ.)

• Soak capacity: 3 strips

Facility Requirements

• Nominal supply voltage2: 208 ‐ 230 VAC

• Standard air pressure: 5.5 bar (80 psi)

• Air consumption3: 100 to 450 l/min

• LN2 pressure: > 1.5 bar (22 psi), for cold test

• LN2 consumption: 12l/h

• CDA dew point: ≤ ‐70°C

ESD Protection

• Field strength at device: 100 Volt/in (max.)

• Ground strap jack: 1 M‐Ohm to ground

• Device path: conductive and grounded

Physical Dimensions (Width x Depth x Height)

• Basic handler: 1,200 x 830 x 1,040 mm

• Handler with slotted cassette modules:

• 2,400 x 1,000 x 1,225 mm

• Handler with stacked cassette modules:

• 2,000 x 830 x 1,040 mm

Electrical Interfaces

• RS 232 standard, IEEE 488

• Network standard, USB at OPI (standard)

• Strip mapping: SECS/GEM and XML, SEMI G84/G85, E142

Contactors or Probe Cards

• Nearly unlimited range for substrate based bare dies, WLP’s or molded ICs

• Smart power, analog, RF, mixed signal, digital MEMS and KGD contactors are available

Optional Modules

• Stacked or slotted loader/unloader

• Laser marker, 2DID readers

• Various sensor test applications available

Advanced Packaging / Bare Die Test Configuration

• Certified for clean room class 1000

• 3D package test

• Substrate based, bare die handling

• Vacuum contacting

• Single device in a carrier or strip handling

• Flipping module (up/down)

Various Sensor and MEMS Options

• Magnetic Test Unit

• Pressure Test Unit