Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)

Lam Research EOS

Asset ID: 79171

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Lam Research

EOS

Single Wafer Processing

Etch/Clean - Wet Processing

Equipment details:

Date of Manufacture: 2014

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan City, Taiwan

Available date: Currently Available

Process: BACKETCH


Tool config is based on original PO, please verify tool details at tool inspection


Process: SWC_300HF Processes

Sending Site Workstation Name: SWC_300HF_EOS

Software Version (include revision #): 1.84-SP9-SC8-HF6-Release

System Power Rating: 208AC 3-phase for System


Chm/Unit Position  1: process chamber- 300:1DHF, DICO2, N2, IPA

Chm/Unit Position  2: cabinet- IPA, 300:1DHF, CDA, N2, DICO2, DIW

Chm/Unit Position  3: DICO2 module- CO2, DIW, CDA

Chm/Unit Position  4: Chiller- PCW, DHF


Base System

Front End Robot.: Vortex

Process Robot: Vortex Qty 2

Host Controller: Host Interface

Product Type: EOS GS L

Wafer Mapping capability: E84 Parallel I/O Sensors


System software

PC Version: OUI software

Main Controller: System software

Host Controller: Host Software


FOUP Station

FOUP: 300mm FOUP

Load Port: Number of FOUP


Process Module 1-16: Lam

ACID Cabinet ICDS1: (80 liters on EOS),DHF,20L for 100:1 HF (80 liters on EOS)

ACID Cabinet ICDS2: (80 liters on EOS) ,5L for IPA Yes

ACID Cabinet ICDS3: (80 liters on EOS),DHF,20L for 100:1 HF Heat Exchanger

ACID Cabinet ICDS4: (80 liters on EOS) ,5L for IPA 

Exhaust Control: Acid Exhaust 

DIW System: From Tool Main Frame ,Dispense 4 DIW 

Gas System: From Tool Main Frame, N2 

Gas System: From Tool Main Frame, CDA 

Process Module 1-16: Acid Exhaust line Yes

Process Module 1-16: Alkali Exhaust line Yes

"Fire Extinguisher: Required for IPA

 dry(set)繹寶 "

DICO2 module: mixing DIW and CO2 

Chiller: PCW to control chemical timperature 

CCTV box: local 

Cooling system: Cooling DHF system 

Safety Precautions: LOTO Independent lockout device for each chemical and gas line for maintenance

Facilities: Chemical Line Connection Rear Bottom (C.S.S.)

Facilities: Electrical Supply Option for transformer(208 to 400V).


N2 Load Port Exists: No


Chemical Mixing and Supply

Supply line

Line 1: DHF

Line 2: IPA

Line 3: SC1


Setting Ratio: MML mixing

DHF: 1:300/1:100

IPA: recipe set

DIW: RT


Flow rates

DHF: 2000ml/min ,1500 ml/min (needle valve controlled)

DI: 1500 ml/min(needle valve controlled)

IPA: 100~145 ml/min


Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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