Equipment details:

Date of Manufacture: 2007

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: 9/1/2023

• Currently Configured for 300mm wafer sizes
• MFG Date: 2007
• Install Type: Stand-Alone
• Factory Interface (FI):
o Frame Config: Metro Ready
o Load-port Type: (3) Asyst ISO
o Pre-Aligner
o Wafer Handling Robot: Track Type w/Dual End Effecter
• Polisher (L/R):
o Process (L/R): STI
o Polishing Heads: 300mm AL Head, Gen. II
o Endpoint: TCM & Friction
o Platen Type (Speed): Ceramic (SIC), 10-150 RPM
o Pad Type(Left): IC1000
o Pad Type: Right): PolyTex
o Platen Pad Conditioner: Diamond Disk, Sweep Driven
o Slurry Delivery: Closed Loop (CLC) Delivery
o Slurry Flow Range: 25-250ml/min (low flow rate)
o Slurry Line 1: HS-8800
o Slurry Line 2: none
o Slurry Line 3: none
o Wafer Slip-out Sensor: Yes
o Wafer Loss Camera: No
o Platen Cooling Flow Monitor: Tokyo KEISO
o Platen Cooling Temp Monitor: User Configurable alarm Settings
o Dresser DIW Flow Meter: Flow Range 1.0-1.5 L/min
o Atomizer: Yes
• EndPoint (L/R):
o Table Current Monitor (TCM): Yes
o Multi-process Monitor ME20 for EPD: Yes
o Metrology Option: NovaScan 3090
• Cleaner (L/R):
o Cleaner 1 Type: Roller Brush
?? Megasonic
?? Chem. Delivery Type: (1) Chem CLC 0.0-1.0 L/min (alarm capability)
?? Chemical 1 Upper Flow Meter: 0.0-1.0 L/min
?? Chemical 1 Lower Flow Meter: 0.0-1.0 L/min
?? Chemical Line 1: HF
?? Chemical Line 2: n/a
?? Bevel Edge Cleaning: Yes
o Cleaner 2 Type: Roller Brush
?? Note: No Megasonic
?? Chem. Delivery Type: (1) Chem CLC 0.0-1.0 L/min (alarm capability)
?? Chemical 1 Upper Flow Meter: 0.0-1.0 L/min
?? Chemical 1 Lower Flow Meter: 0.0-1.0 L/min
?? Chemical Line 1: TMAH
?? Chemical Line 2: n/a
?? Bevel Edge Cleaning: Yes
o Cleaner 3 Type: Roller Brush
?? Note: No Megasonic
?? Chem. Delivery Type: (1) Chem CLC 0.0-1.0 L/min (alarm capability)
?? Chemical 1 Upper Flow Meter: 0.0-1.0 L/min
?? Chemical 1 Lower Flow Meter: 0.0-1.0 L/min
?? Chemical Line 1: TMAH
?? Chemical Line 2: n/a
?? Bevel Edge Cleaning: Yes
o Spin Rinse Drier: Pencil Brush
?? Chem. Delivery Type: (1) Chem CLC 0.0-1.0 L/min (alarm capability)
• Options:
o Robot D: Yaskawa
o Robot R: Yaskawa
o Robot L: Yaskawa
o Status Lamp (RYGB, Front/Rear)
o Monitor 1: Front
o Monitor 2: L-Side
o Monitor 3: R-Side
o EPD Monitor: R-Side
• Software:
o Main SW ver: 7.5.02
o CPU-1 (OS/9) ver: 7.5.02
o CPU-2 (OS/9) ver: 7.5.00
o Touch Panel Control ver: 7.5.00
o Touch Panel Drawing ver: 7.5.00
o Online ver: 7.5.00
o ME10/ME20 ver: 2.4.30.0
• Communication:
o Controller (Logic): VME
o Controller (Process Database): Touch Panel
• Heat Exchanger / Chiller:
o (1) Advanced Thermal Sciences SX-21
• Facility:
o Seismic Support: Bracket locations to be provided
o Chemical Connections: Bottom
o Exhaust Connections: Top
o Gas Connections: Bottom
o Drain Connections: Bottom
o Power Requirements: 208VAC (3.4KW) , 200A, 3 Phase, 3-Wire+ Gnd, Freq 60Hz
?? Wiring Diagram #: 110R040511601
• Missing / Damage Parts:
o None