Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (F16)
PECVD (Chemical Vapor Deposition)
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
Tool config is based on original PO, please verify tool details at tool inspection
Process: TEOS
Chamber Qty:3
Overall Tool Condition
Any Field Modifications: No
All Cables present: Yes
Any Corrosion visible on modules: No
Any Missing / Damaged Parts: No
Shipping Brackets Included: No
Wafer Handler: Yes
Handler Type ATM, vacuum
# of Cassette / FOUP Loaders: 3 FOUP loaders
Robot Type: Signal arm
End-Effecter Type: Self-aligner
Pre-Aligner: No
Mini-Environment: Yes
System Software
System SW (OS) version: WindowsXP 5.1 2600
System SW (App) version: VER1.10b
SEMI Std Options: E84
Communication Interface
GEM / SECS: GEM
HSMS: yes
Supporting Equipment
Power Supply: AC 208V 3 phases, 50/60 Hz
AC Dist Box: Yes
Ext Transformer: No
UPS: Yes
Heat Exchanger / Chiller: No
Backing Pump(s): No
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
Get in touch
Ask about our equipment solutions, ranging from Macquarie equipment inventory sales, sourcing programs, surplus disposition options, and direct equipment purchases.