Macquarie Semiconductor and Technology on behalf of Diodes Zetex Semiconductors Ltd.
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Date of Manufacture: 1997-01-08
Currently Configured for: 200mm
Current Equipment Status: Available
Location of Equipment: Oldham, United Kingdom
Available date: Currently Available
OEM: IPEC
MODEL: 372M
================= Feature for Reference =====================
The IPEC 372M is one of the most widely installed CMP tools ever. Designed for both oxide and metal planarization processes, the IPEC 372M offers single wafer, two-step polishing for substrates up to 200mm.
Standard Features Include:
- Automated control with soft touch key pad
- Two platen process for post polish buff
- Multiple slurry dispense
- In-situ pad conditioner
- Material compatibility for medium and low ph slurries (1 – 12)
- Down force up to 750lbs.
- Controllable wafer back pressure
- Polish head clean station
- External interface for end point capability
Optional Features
- Multizone ViPRR carrier upgrade
- Temperature controlled platens
- SECS II Interface
Facilities:
- Dimensions: Width: 67”, Depth: 97”, Height 92”
- Electrical, 208 VAC, 3-PH, 50/60Hz
- DI Water: Avg Flow: 6gpm / Pressure: 25 – 30psi, minimum
- Nitrogen or CDA: Peak 10SCFM
- Compressed Air: 6SCFM
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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