Macquarie Semiconductor and Technology on behalf of Macquarie Semiconductor and Technology Inc. Taiwan Branch - UMC
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Shibaura Engineering Works Ltd.
Etch/Ash/Clean - Plasma Processing
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Tainan 744, Taiwan
Available date: Currently Available
Inspect to confirm configuration and condition.
Tool has been Disconnected, Decontaminated, Deinstalled.
The install Type is Stand-Alone.
Off-Line Date is 2017/07/11.
All Cables are present.
The shipping Brackets are included.
Handler Type is Single wafer. (#FOUP loader)
Robot Type is RORZE RT130-521.
End-Effecter Type is RT130-521-B01.
SEMI Std Options is E84.
Power Supply is 208 VAC 60HZ 3P 31KVA.
AC Dist Box is 208 VAC 60HZ 3P 5KVA.
Heat Exchanger / Chiller is ATS DEX-20ADI *2.
Backing Pump(s) is Edward iXH1820 *3.
CDA is 160 LPM ,3/8” swagelok.
DIW is 20 LPM ,3/4” swagelok.
Vacuum is 30 LPM ,3/8” swagelok.
Power is 110V 2P.
The equipment no missing parts, but the UI computer HD is damaged.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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