Macquarie Semiconductor and Technology on behalf of Macquarie Semiconductor and Technology Inc.
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Date of Manufacture: 2017-12-01
Currently Configured for: To be determined
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: San Jose, United States
Available date: TBD
Audit to verify
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The NSX 330 Series enables advanced packaging processes by directly improving the cost of ownership by enabling multiple applications in a single platform.
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
The NSX 330 System offers robust platform technology, including: high-acceleration staging, high-speed multi-processor computing and highly flexible software with an unprecedented level of usability. With over 1,000 NSX Systems installed worldwide, the NSX 330 System offers increased 2D inspection and metrology throughput and a broad portfolio of 3D sensors supporting critical advanced packaging applications.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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