Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, G.K. (F15)

Accretech/TSK UF3000

Asset ID: 209896

Print spec sheet

Accretech/TSK

UF3000

Production Wafer Prober

Wafer Prober

Equipment details:

Date of Manufacture:

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: Currently Available


UF3000 Standard Feature

Overall Accuracy Within 2 µm

Wafer Size 8", 12"

X/Y axis Probing Area ±170 mm (X/Y axis Probing Area)

X/Y axis Maximum Speed X axis 300 mm/s Y axis 230 mm/s

Z axis Full Stroke 37 mm

Z axis Maximum Speed 30 mm/s

θ axis Rotation Range ±5 deg.

Fine Alignment CCD ITV Image Processing

Loader Cassette Mounts 1 (2nd cassette with option)

Loader Wafer Handling Robot Arm / Backside Holding

Hard Disk 3.5" 20GB (1 unit standard)

Floppy Disk 3.5" 2HD / 2DD (1 unit standard)

MO 230 / 540MB (1 unit standard)

Display 12.1" TFT Color LCD

Power Consumption Less than 2kVA

Air Supply Source Pressure 0.6 MPa or more

Air Supply Consumption Approximately 0.1 liters / wafer

Vacuum Supply Less than -80 kPa, 30 liters / minute

Dimensions 1508W × 1587D × 987 H mm

Weight 1500 kg (Standard)

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