Macquarie Semiconductor and Technology on behalf of Micron Technology, Inc. (Boise)
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Date of Manufacture: 2007-01-01
Currently Configured for: To be determined
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Boise, United States
Available date: Currently Available
FALIT laser decapsulation tool
FALIT Laser Systems for semiconductor failure analysis lab, forensic science lab research
Major users are the failure analysis labs in the semiconductor industry, intelligent automotive industry, and forensic labs in law enforcement departments.
Materials in the Semiconductor Industry : It adapts to the widest range of epoxy mold compound and various types of fillers, keeping gold, silver, brass, or aluminum bonding wire, the silicon, GaAs, InP die undamaged.
Laser Technology Refined : This application can fully or partially replace traditional micro-drilling, sawing, and chemical etching processes. The FALIT® provides fast and accurate solutions for IC de-capsulation, cross-sectioning, and de-lidding, expose the insides from ceramic, KOVAR, gel, and mold compound capsulation, expose defective bonding wires, observe solder ball mid-position and lamination cracks, and more evidence of failure.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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