Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)
Endura II Front-End Metallization
PVD (Physical Vapor Deposition)
Date of Manufacture: 2015
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: 8/19/2022
PVD - 15-3AMAT_END_VXLRW - ENDURA2 -
OEM | AMAT | ||
Tool Model | ENDURA | ||
Process | Metal (tungsten) | ||
Software Version (include revision #) | 15-3AMAT_ENDURA2_XLRW_01 | ||
System Power Rating | enB2.5-1.8 | ||
Loading Configuration | 400/440/480VAC 3phase STAR and 200/208VAC 3phase STAR | ||
3 Load Ports |
Vendor Chm Model | Chemicals / Gases Used (not to use Micron Proprietary names) | ||||
Chm/Unit Position 1 | XLR-W_______________________ | PAr and PN2__________________________________ | |||
Chm/Unit Position 3 | XLR-W_______________________ | PAr and PN2__________________________________ | |||
Chm/Unit Position 4 | XLR-W_______________________ | PAr and PN2__________________________________ | |||
Chm/Unit Position E | DMD_______________________ | PAr__________________________________ | |||
Chm/Unit Position F | DMD_______________________ | PAr__________________________________ |
Tool: | ||||
Process Unit: | Model: | Remark | ||
Controller: | FES (CGA) | |||
MFC/Pressure Unit: | Brooks GF-125C 150SCCM AR/200SCCM N2/20SCCM AR | |||
Drive Mechanisms: | NA | |||
FOUP Opener: | SINFONIA (SELOP12F25-S7A0021) | |||
Gas System: | NA | |||
Exhuast System: | NA |
Fab15 confirmed there were no missing or damaged parts.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
Get in touch
Ask about our equipment solutions, ranging from Macquarie equipment inventory sales, sourcing programs, surplus disposition options, and direct equipment purchases.