Macquarie Semiconductor and Technology on behalf of Macquarie (Asia) Pte Ltd. Taiwan Branch - UMC
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Etch/Ash/Clean - Plasma Processing
Date of Manufacture: 2012
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Tainan 744, Taiwan
Available date: Currently Available
HARD DRIVE WILL BE REFORMATTED. OPERATING SOFTWARE IS NOT INCLUDED.
Tool is cold down.
Inspect to confirm configuration and condition.
Configuration :
Tool can produce wafers as is.
All cables are present.
Process chamber type is RLSA Polye.
Signal Lamp Tower / Clean Room Manuals / Standard Manuals are included but Remote Service Monitors not included.
Process Kit Part Numbers :
Item Part Number
Vpper Wall 28002
Depo Shield 33005
Vpper Jacket 14014
Lower Jacket 13020
Exhaust Plate 22007
Shutter 32009
Shield(RLSA) Ring AA11OV1
Injector M876V2
Insulator B S320V1
Focus Ring Quartz 25584
Insulator A Quartz 06737
Dielectric Plate Dimple Quartz 34054
Shower Ring Quartz 16691
RLSA Chamber information :
ESC for wafer with Dual He Cooling
Nihon Koshuha Microwave Generator / Model is MKS 050B05 DL-PS
Turbo Pump Details : Position 2 SHIMADZU / Model is FT2301D
Generator Details : Position 2-Lower ADVANCED / Model is PARAMOUNT 3013
Process Chamber Roughing Pump is EDWARDS / Model is IXH30301
Cassette Chamber Pump is EDWARDS / Model is IXL120
Transfer Chamber Pump is EDWARDS / Model is IXL120
Chiller Details : THERMO CHILLER 3MC / Model is HRZ010-WS
Gas Box Configuration :
Gas Line Gas
1 H2
2 CH2F2
3 HBr
4 CL2
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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