Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (F16)
Metal CVD (Chemical Vapor Deposition)
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
Tool config is based on original PO, please verify tool details at tool inspection
Mainframe Type: Centura AP
Process Applications: W
Chamber Qty 4
Process: WCVD
Number of Load Ports: 3
Carrier ID Reader (E99):Yes
WIP Delivery Type: OHT
Dual FI Robots: No
Atmospheric Robot Type: YASKAWA
Light Curtain: Yes
In-Situ Metrology Unit: Yes
Turbo Throttle Valve (TTV) Drive: Direct
Dual Independent Helium Control: 10/10 TORR (std)
Plasma Detect: Yes
Clean Method: Astron RPS
Chamber Roughing Pumps
Manufacturer: Kashiyama
Model: SDE1203 BL
Mainframe and Load Lock Pump
Manufacturer: ALCATEL V3.6 A100L IPUP
Model: V3.6 A100L IPUP
Heat Exchanger
Manufacturer: SMC
Model: INR-012D
Qty: 2
Gas Delivery
Gas Line Input: Bottom Feed
Gas Box Configuration
Chamber Argon MFC: 10000 sccm
Chamber Argon MFC: 10000 sccm
Chamber Argon MFC: 6000 sccm
Chamber Argon MFC: 3000 sccm
Chamber NF3 MFC: 2000 sccm
Chamber WF6 MFC: 500 sccm
Chamber WF6 MFC: 100 sccm
Chamber SiH4 MFC: 200 sccm
Chamber H2 MFC: 8000 sccm
Chamber H2 MFC: 3000 sccm
Damage/Missing parts list
TM robot blade- missing
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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