Macquarie Equipment Trading on behalf of Micron Technology Taiwan, Inc. (F11)

Hermes Microvision (HMI) eP3 XP

Asset ID: 101235

Print spec sheet

Hermes Microvision (HMI)

eP3 XP

E-beam Inspection

Metrology Equipment

Equipment details:

Date of Manufacture: 2014

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan City, Taiwan

Available date: Currently Available


Process: SEMINSP


Tool config is based on original PO, please verify tool details at tool inspection

Tool performance report is available by request


Pixel rate 100M pixels/second

Beam current 50pA - 50nA

Landing energy 50 - 3000 eV

No.5 bias voltage - 3000 ~ 3000 eV

Minimum pixel size 3nm


Wafer Loader Unit

1.Integrated front-end,

2.dual pod 300mm FOUP.

3.Signal Tower


Computation Units

1. 2High quality flat panel display units;joystick,keyboard,mouse,DVD drives

2. GUI computer:Dual XEON CPU2.4GHZ,4GBmemory,3x320GB HDs,Windows XP operation system

3.Host computer:Dual XEON CPU2.4GHZ,4GBmemory,3x320GB HDs,Windows XP operation system

4.Firewall Computer:XEON CPU3.4GHZ,4GBmemory,3x320GB HDs,Windows XP operation system

5.Z computer:Intel i5-680 CPU3.6 GHZ,4GB memory,1x160 GB HD,Windows XP operation system

6.ADC computer: 6-core XEON CPU2.66 GHZ,24GB memory,3x2 TB and 1x160GB HDs, Linux operation system

7.Image Computer: 6-core XEON CPU2.66 GHZ,16GB memory,2x160 GB HDs, Linux operation system

8.3xClient Computers: 6-core XEON CPU2.66 GHZ,8GB memory,1x160 GB HDs, Linux operation system

9. GLM Computer: 6-core XEON CPU2.66 GHZ,8GB memory,1x160 GB HDs, Linux operation system


Communications Capability Etherent port using TCP/IP,Internet connectivity and remote control

System Software Ver.2.9.7.3 "Easy to use GUI,Recipe setup wizard; system calibration, diagnostics and monitoring,Job queuing,

sample load/unload control,Automation support;Hot spot monitoring,CDU measurement;

Klarf defect auto-reconfirmation,SuperNovaTMD2DB engine connectivity support"


System Hardware Ver.77-600-3000003-00

1.Main inspection chamber

2.loadlock

3.Optics alignment subsystem

4.300mm X-Y stage and motion controller

5.Z stage

6.E-chuck wafer holder and controller

7.Active damping subsystem

8.System protection module

9.High Vacuum pumping system and controllers

10.PDU with A/C and D/C power supply modules

11.Line conditioner and UPS unit

12.Image scan and acquisition subsystem

13.Electron source HV power sub-system

14.Stage HV power sub-system

15.Pre-charging subsystem


Electron Source and Column Assy

1.TFE emission electron beam source subsystem

2.Electron-optics Column subsystem

3.High-speed SE detection and amplification subsystem


Standalon User Console

Automation Kit

Light Curtain

Safety EMO buttons(x4), Safety interlocks

Documentation eP3 pre-installation documentation, eP3 user manual

Dry pump EDWARDS EPX180LE (Not included with tool


Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales


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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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