Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)
Date of Manufacture: 2019
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.
DFD6361 offers highly consistent and dependable cut quality through the new Synchro Spindle™ featuring superior radial rigidity. An atomizing nozzle cleaning mechanism can also be installed in the spinner unit as an option to effectively clean wafers after dicing (Patent no.3410385)
|Specification||Unit||1.2, 1.8 kW||2.2 kW|
|Max. workpiece size||mm||Φ300|
|Cutting speed||mm/s||0.1 ～ 600|
|Positioning accuracy||mm||Within 0.002/310|
(Single error) Within 0.002/5
|Z-axis||Max. stroke||mm||14.7 (For Φ2 inch blade)||14.9（For Φ3 inch blade）|
|θ-axis||Max. rotating angle||deg||380|
|Spindle||Rated torque||N・m||0.19（1.2 kW）|
|Revolution speed range||min‐1||6,000 ～ 60,000||3,000 ～ 30,000|
|Machine dimensions(W×D×H)||mm||1,200 × 1,550 × 1,800|
|Machine weight||kg||Approx. 2,050|
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.
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