Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)

Disco Hi-Tec DFD6361

Asset ID: 210853

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Disco Hi-Tec

DFD6361

Wafer Dicing Saw

Sawing

Equipment details:

Date of Manufacture: 2019

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available



DFD6361

Fully Automatic Dicing Saw

Advanced performance for Φ300 mm dicing

Enhanced dicing throughput

The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.

Consistent cut quality

DFD6361 offers highly consistent and dependable cut quality through the new Synchro Spindle™ featuring superior radial rigidity. An atomizing nozzle cleaning mechanism can also be installed in the spinner unit as an option to effectively clean wafers after dicing (Patent no.3410385)

Specifications

SpecificationUnit1.2, 1.8 kW2.2 kW
Max. workpiece sizemmΦ300
X-axisCutting rangemm310
Cutting speedmm/s0.1 ~ 600
Y1・Y2-axisCutting rangemm310
Index stepmm0.0001
Positioning accuracymmWithin 0.002/310
(Single error) Within 0.002/5
Z-axisMax. strokemm14.7 (For Φ2 inch blade)14.9(For Φ3 inch blade)
Moving resolutionmm0.00005
Repeatability accuracymm0.001
θ-axisMax. rotating angledeg380
SpindleRated torqueN・m0.19(1.2 kW)
0.29(1.8 kW)
0.7
Revolution speed rangemin‐16,000 ~ 60,0003,000 ~ 30,000
Machine dimensions(W×D×H)mm1,200 × 1,550 × 1,800
Machine weightkgApprox. 2,050


*Product appearance, features, specifications, and other details may change due to technical modifications.

*Please read the standard specification sheet thoroughly before use.

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