Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, G.K. (F15)
Date of Manufacture: 2005
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
CMP 15-3AMAT_REF-3_4SON AMAT REF-3
FI Server is included but a Hard Disk Drive is not included in tool.
[Platen1]
>30inch platen
(max133rpm)
>4inch pad conditioner
(DDF3type,30-120rpm)
>slurry line1:D4505
(max400ml/min)
(tube pump)
>torque end point system
[Platen2]
>30inch platen
(max133rpm)
>4inch pad conditioner
(DDF3type,30-120rpm)
>slurry line1:D4505
(max400ml/min)
(tube pump)
>torque end point system
[Platen3]
>30inch platen
(max133rpm)
>4inch pad conditioner
(DDF3type,30-120rpm)
>slurry line1:CES333
(max400ml/min)
(tube pump)
>torque end point system
[Head1]
>membrane press head
(3zone 0-15psi)
>head spindle
(max200rpm)
[Head2]
>membrane press head
(3zone 0-15psi)
>head spindle
(max200rpm)
[Head3]
>membrane press head
(3zone 0-15psi)
>head spindle
(max200rpm)
[Head4]
>membrane press head
(3zone 0-15psi)
>head spindle
(max200rpm)
[Cleaner1]
>megasonic 2roller+1idler
>circulating DIW flow
(2.0l/min)
>control temp
(20-50deg)
>megasonic power
(950kHz,600w)
>wafer rotation speed
(6rpm)
[Cleaner2]
>2brush 3roller+1idler
>rotation speed
(brush:max700rpm)
(wafer:max50rpm)
>DIW delivery
(DIW:2000ml/min)
>chemical delivery
(NH4OH:2000ml/min)
>brush rinse
(DIW:1000-4000ml/min)
[Cleaner3]
>2brush 3roller+1idler
>rotation speed
(brush:max700rpm)
(wafer:max50rpm)
>DIW delivery
(DIW:2000ml/min)
>chemical delivery
(FPM:2000ml/min)
>brush rinse
(DIW:1000-4000ml/min)
[Dryer]
>spin rinse dryer
(max:2500rpm)
>ramp heater
(1000w infrared heater )
[load port]
>3load port
Other missing or damaged parts: Not reported.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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