Macquarie Semiconductor and Technology on behalf of Analog Devices, Inc.

Eshylon Scientific Es-304

Asset ID: 209877

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Eshylon Scientific


Temporary Bonding System

Wafer Bonding

Equipment details:

Date of Manufacture:

Currently Configured for: 150mm

Current Equipment Status: Available

Location of Equipment: Milpitas, United States

Available date: Currently Available

Eshylon Scientific Tabletop Charging Station, Model Es-304

Temporary bonding has emerged as a mission-critical application for production of today's advanced devices in Semiconductor, Automotive, Defense, Quantum Computing, Biomedical and other industries.

Eshylon's new, patented Mobile Electrostatic Carrier (MESC) platform enables leading-edge device fabrication by providing a rigid but mobile platform for handling challenging substrates in an R&D, pilot line or high volume manufacturing environment.

Utilizing electrostatic forces, Eshylon carriers can bond in seconds to a target substrate for processing then release the substrate gently without the need for additional clean steps or adhesives, all on a single tool.

High Throughput

Room temperature bond/debond in seconds enables rapid throughput for R&D, pilot line or high volume manufacturing

Extraordinary Yield

Near perfect yields due to damage-free, delicate release

Easy & Clean

Easy, user-friendly bonding with no intermediate layers, no adhesives and no extra clean steps

Ultra Low Cost

Single tool and reusable carriers provide lowest total cost of ownership in the industry


Handles any shape and 100mm, 150mm, 200mm and 300mm substrates to less than 50 micron wafer thickness

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.

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