Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (F16)
Date of Manufacture: 2007
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
RDA 16-3AMAT_SEMG3_SEMREV_01 AMAT SEMG3 SEMV
Tool config is based on original PO, please verify tool details at tool inspection
Loading Configuration: FOUP
Number of Cassette/FOUP Positions: 2
Loadport Make/Model: TDK/TAS300
All Cables Present: Yes
SECS-II GEM: Yes
HSMS: Yes
Main Platform: SEMVision G3
SEMVision G3 Options
Main Controller SW Version: 5.4.500
User Name: aa
Password: aa
IP Software Version:5.4.500_Pre21
MEC Version: 5.4.500
WHC Version: 5.4.500
ADC Package: Yes
Integrated EDX Spectrometer: Yes
Tilt EDX: No
Operator Free Unpatterned Wafer Review: Yes
Auto Process Inspection & Voltage Constant: No
HAR Mode: Yes
Wafer Edge Inspection/Review: No
Universal Chiller: No
Clear Anodized End Effector: Yes
Programmable Signal Tower: Yes
Off-line Station: No
GIS Crucible Kit: No
Platinum Crucible: No
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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