Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, G.K. (F15)
Etch/Ash/Clean - Plasma Processing
Date of Manufacture:
Currently Configured for: To be determined
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
DRY ETCH 15-3AMAT_ADVTG5_PTC3 AMAT CENG5 PTC
Tool has been de-installed and is stored in an off-site warehouse.
Missing parts: Qty 3 of SINGLE RING QUARTZ .09HEIGHT .12 RECESS, Part number 0200-05959 reported.
[Chamber A]
Chamber type:AdvantEdge G5
Gas config.(sccm)=MFC full scale
HBR(400）/CH2F2(100)/CL2(50)/
CL2(400)/O2(10)/O2(100)/HE(400)/
N2(200)/SF6(200)/SF6(30)/CF4(300)/
Ar(400)/CHF3(400)
Source 13.56MHz, max 3000 W
Bias 13.56MHz Hz, max 1500 W
Lid Temp Control ~95℃
ESC Temp Control ~85℃
[Chamber B]
Chamber type:AdvantEdge G5
Gas config.(sccm)=MFC full scale
HBR(400）/CH2F2(100)/CL2(50)/CL2(400)/
O2(10)/O2(100)/HE(400)/N2(200)/
SF6(200)/SF6(30)/CF4(300)/Ar(400)/
CHF3(400)
Source 13.56MHz, max 3000 W
Bias 13.56MHz Hz, max 1500 W
Lid Temp Control ~95℃
ESC Temp Control ~85℃
[Chamber C]
Chamber type:AdvantEdge G5
Gas config.(sccm)=MFC full scale
HBR(400）/CH2F2(100)/CL2(50)/CL2(400)/
O2(10)/O2(100)/HE(400)/N2(200)/
SF6(200)/SF6(30)/CF4(300)/Ar(400)/
CHF3(400)
Source 13.56MHz, max 3000 W
Bias 13.56MHz Hz, max 1500 W
Lid Temp Control ~95℃
ESC Temp Control ~85℃
[Chamber D]
Chamber type:AXIOM
Gas config.(sccm)=MFC full scale
H2/N2（5000）/O2(10000）/N2（1000）
Power max 5000 W
No photos provided. Please inspect to collect photos.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
Get in touch
Ask about our equipment solutions, ranging from Macquarie equipment inventory sales, sourcing programs, surplus disposition options, and direct equipment purchases.