Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)

Tokyo Electron Ltd. (TEL) Telius 305 DRM

Asset ID: 207066

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Tokyo Electron Ltd. (TEL)

Telius 305 DRM

Dielectric Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture: June 4, 2002

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: 10/7/2022

DRY ETCH - 15-3TEL_DRM_MN_51_2 - DRM -


TELIUS-DRM[2ch]


Missing or damaged parts: Fab15 confirmed there were no missing or damaged parts.


UPDATED CONFIGURATION:

[Chamber A]

Chamber type:DRM

Gas config. (sccm)=FCS full scale

2line(advanced radical distribution control)

 Ar(754)/C4F8(43)/O2(46.8)/O2(1215)

 CF4(336)/CHF3(163)/CH2F2(144)/N2(300)

 CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)

RF 13.56MHz, max 5000W

Temp Top +30~+80℃

     Wall +40~+80℃

     ESC -10~+60℃


[Chamber B]

Chamber type:DRM

Gas config. (sccm)=FCS full scale

2line(advanced radical distribution control)

 Ar(754)/C4F8(43)/O2(46.8)/O2(1215)

 CF4(336)/CHF3(163)/CH2F2(144)/N2(300)

 CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)

RF 13.56MHz, max 5000W

Temp Top +30~+80℃

     Wall +40~+80℃

     ESC -10~+60℃



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