Macquarie Semiconductor and Technology on behalf of Analog Devices, Inc.

Orthodyne Electronics M20B

Asset ID: 208822

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Orthodyne Electronics

M20B

Wire Bonder

Bonder

Equipment details:

Date of Manufacture:

Currently Configured for: To be determined

Current Equipment Status: Available

Location of Equipment: Milpitas, United States

Available date: Currently Available

Orthodyne Electronics Wire Bonder, Model M20B, with Nikon SMZ660 Microscope


Ultrasonic large wire bonder

Wire / Ribbon size: Wire 4 to 20 mil aluminium / Gold, 3 - 10 mil copper

Cutoff method: Cut / Pull

Work holder: 60 mm / 100 mm

Modes of operation: Semiautomatic and manual

Operator control: Top button / Foot switch

Manipulator: 5:1

Working range: 1"

Type: True panto graph

Machine stops: Home, first search, loop, second search


Ultrasonic generator Type: ORTHODYNE 300 Series 2 Channels

Frequency: 60 kHz, Phase-locked

Power output: 0 - 25 Watts

System check: Test push button

Time range: 0 - 500 ms, 30 ms Prebond delay

Transducer: ORTHODYNE Piezoelectric ceramic


Bonding head: Bonding direction: Front to back

Tool type: Large wire (4 to 20 mil): Larrison twin-groove

Deep access ribbon (1.0 x 5 to 2 x 40 mil): Flat face with guide slot

Deep access wire (3 to 5 mil): Single groove with guide hole


Wire and ribbon handling

Bonding force: 95 to 1100 grams

Cutoff preload: 0 to 500 grams

Step back range: 0 to 0.300"

Loop and search height: Adjustable

Bonding plane height differential: 0.100", With manual Z option


Power: 115/230 V, 3/1.54, 50 to 60 Hz, Single phase (100 V option).

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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