Macquarie Semiconductor and Technology on behalf of Inspire Technologies, Inc.
Date of Manufacture:
Currently Configured for: 200mm
Current Equipment Status: Available
Location of Equipment: Caldwell, United States
Available date: Currently Available
P/N : 1790A-8-0028
Q'ty : 3
Condition : New and open the box
The Process Probe 1790 characterizes and fine-tunes your process conditions to improve equipment performance, wafer quality, and yield. The Process Probe 1790 is designed for use in temperatures ranging from 0°C to 1100°C, and for a wide range of applications including cold wall, RTP, sputtering, CVD, plasma strippers, and epitaxial reactors.
Our specially patented ThermaBond technique is utilized to ceramically bond the deeply immersed thermocouple into a re-entrant cavity in the silicon to improve heat transfer and bond strength. The 1790 allows you to measure wafer temperatures directly, in real time, during each critical step of your process cycle. The Process Probe 1790 optimizes temperature controller parameters, improves uniformity in multi-zone heaters, and determines wafer temperature stabilization times.
Technology : ThermaBond Thermocouple Technique
Applications : Wafer; CVD / PVD; Etching
Measurements : Temperature
Wafer / Part Size : 50 to 300 mm (2.0 to 11.8 inch)
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