Equipment details:

Date of Manufacture:

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: Currently Available

Tool S/N: T239456
Base System Descrition
Ulpa Filtration: 70006-401
Earthquake: No
Exhaust: 3 Adjustable Exhaust
Drip Pans: 1
LT Process Robot: 610T0300-01
Station Control
User Interface: Rear - 650T0030-03, Front: 650T0030-501
Display: English
Operating system: Embedded XP system, Software version - 2.13.4.24
USB Ports: 2 USB ports
Intermediate station: None
Metrology unit: 90005-81
Buffer station: 640T0377-01
Transfer Robot: 610T0300-01
Factory Interface Options
Manufactor: Semitool Inc.
FOUP / Cassette - Part Number: Entegris- F300 Auto-pod (01-018675)
Wafer Diameter: Wafer Diameter : 300 ± 0.25mm
Wafer Pitch: Half Pitch
Wafer Mapping capability: E84 Parallel I/O Sensors (4012-25), E99 Carrier ID Reader, 3 hermos RF tag readers
Number of FOUP: 3 load ports 640T0147-505
Chemical Connections
Line-1: Catholyte A 180L
Line-2: Anolyte A 65L
Line-3: N/A
Line-4: N/A
Line-5: H2SO4
Line-6: H2O2
Line-7: CDA
Line-8: DI
Line-9: N2
Line-10: House Vacuum
Line-11: CO2 Fire Suppression
Catholyte A
Monitoring
Photospec probe: 90005-01
pH probe: 61326-16
Sampling Port: 429T1635-503
RTA Probe: 90005-50
Real Time Analyzer : 1 RTA GoldBox
Drain
Concentrated Copper waste: Concentrated Copper waste
Dilute Copper Waste: Dilute Copper Waste
Acid Waste: Yes
Chamber 1: Rinse dry with bevel etch capability
? Lift Automation Assy: 200T0085-03
? Mixing tank: 330T0188-01
? Delivery tank: 330T0190-15
? Bowl: 100T0143-09
? Temp control: Heating/Cooling coils
? Dryer: N2
Chamber 2: Rinse dry with bevel etch capability
? Lift Automation Assy: 200T0085-03
? Mixing tank: 330T0188-01
? Delivery tank: 330T0190-15
? Bowl: 100T0143-09
? Temp control: incl in tank assy
? Dryer: N2
Chamber 3 : Electroplating chamber with membrane
? Automation assy L/R: 240T0057-01
? Catholyte Tank A: 330T0186-515
? Anolyte Tank A: 330T0243-501
? Temp control: Heating/Cooling coils
? Anodes : 14400-90
? Membrane: 111T1388-03
? Filters: 7004-63
? Pump: 70959-31
? Debubbler: 119T1289-03
? Ring rinse nozzle: 341T0043-01
? Wafer rinse nozzle: 341T0043-01
? Power supply : 900C0329-01
Chamber 4: Electroplating chamber with membrane
? Automation assy L/R: 240T0057-01
? Catholyte Tank A: 330T0186-515
? Anolyte Tank A: 330T0243-501
? Temp control: Heating/Cooling coils
? Anodes : 14400-90
? Membrane: 111T1388-03
? Filters: 7004-63
? Pump: 70959-31
? Debubbler: 119T1289-03
? Ring rinse nozzle: 341T0043-01
? Wafer rinse nozzle: 341T0043-01
? Power supply : 900C0329-01
Chamber 5:Electroplating chamber with membrane
? Automation assy L/R: 240T0057-01
? Catholyte Tank A: 330T0186-515
? Anolyte Tank A: 330T0243-501
? Temp control: Heating/Cooling coils
? Anodes : 14400-90
? Membrane: 111T1388-03
? Filters: 7004-63
? Pump: 70959-31
? Debubbler: 119T1289-03
? Ring rinse nozzle: 341T0043-01
? Wafer rinse nozzle: 341T0043-01
? Power supply : 900C0329-01
Chamber 6: Electroplating chamber with membrane
? Automation assy L/R: 240T0057-01
? Catholyte Tank A: 330T0186-515
? Anolyte Tank A: 330T0243-501
? Temp control: Heating/Cooling coils
? Anodes : 14400-90
? Membrane: 111T1388-03
? Filters: 7004-63
? Pump: 70959-31
? Debubbler: 119T1289-03
? Ring rinse nozzle: 341T0043-01
? Wafer rinse nozzle: 341T0043-01
? Power supply : 900C0329-01
Chamber 7:Electroplating chamber with membrane
? Automation assy L/R:240T0057-01
? Catholyte Tank A:330T0186-515
? Anolyte Tank A:330T0243-501
? Temp control:Heating/Cooling coils
? Anodes :14400-90
? Membrane:111T1388-03
? Filters:7004-63
? Pump:70959-31
? Debubbler:119T1289-03
? Ring rinse nozzle:341T0043-01
? Wafer rinse nozzle:341T0043-01
? Power supply :900C0329-01
Chamber 8:Electroplating chamber with membrane
? Automation assy L/R:240T0057-01
? Catholyte Tank A:330T0186-515
? Anolyte Tank A:330T0243-501
? Temp control:Heating/Cooling coils
? Anodes :14400-90
? Membrane:111T1388-03
? Filters:7004-63
? Pump:70959-31
? Debubbler:119T1289-0