Macquarie Semiconductor and Technology on behalf of Qorvo Costa Rica S.R.L.

TDK AFM-1503

Asset ID: 208409

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TDK

AFM-1503

Flip Chip Bonder

Bonder

Equipment details:

Date of Manufacture: 2017

Currently Configured for: N/A

Current Equipment Status: Available

Location of Equipment: Heredia, Costa Rica

Available date: Currently Available

TDK Corporation AFM-1503 Compact Ultrasonic Bonder


Country of Origin: Japan

Maximum Wafer Size: 8 Inches

Does NOT include computer seen on top of machine

Manufacturer Name: TDK Corporation

CE marked: NO

Model: AFM-1503

Type of Media Handler:  WAFER

Voltage:200 VOLTS

Frequency:50/60 HERTZ

Phase:3

Current:30 AMPS

Recommended Packaging Form: CRATE


Dimensions:

Standard

Overall:63 x 53 x 86 IN - 3527 LBS  

Metric

1600.20 x 1346.20 x 2184.40 mm - 1599.85 kg

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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