Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)

Applied Materials (AMAT) Centura AP DPS AdvantEdge G2 Poly

Asset ID: 13029

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Applied Materials (AMAT)

Centura AP DPS AdvantEdge G2 Poly

Polysilicon Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture:

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: 8/26/2022

Process: POLYETCH

Process Chb 1,2,3,&4: DPS-II w/ TGN


From original tool PO, please inspect to verify


Standard Specifications

Software Revision: E2.3_43

GEM SEC Revision: GB7.10_21

Wafer Size: Diameter 300+/- 0.05mm(SEMI M28), 775 +/- 25um, Notch

Carrier: FOUP (Comply with SEMI E47.1 (25wafers))

Water Leak Detector: Configured

Regulated N2 Gas Supply Line: Configured

Corrossion Resistant FI & SWLL: Configured

Heated SWLL w/Ceramic diffusrs: Configured

Transfer chbr: Accelerator

Loadlock Isolation- Slit Valve: AP Chemraz 513 Elastomer

Atmospheric Robot: Kawasaki Single Fixed Robot with Edgegrip

Wafer Pass Through: Not available

Loadports: 3 loadports

Loadport type: Enhanced 25 wafer FOUP

Open Cassettes Supported: Not Applicable

Light Tower: 3 light tower

EMO Type: Turn to Release

System Monitors: Monitor #1 is Flat Panel with Keyboard on stand / Monitor 2 is through the wall flat panel (optional)

Monitor Cable lengths: 25ft with 16ft effective

IPUP Type: Alcatel A100L or Toyota 0395-11103


Supporting Remote Units

Etch Common AC Rack (DPS II): Cutler Hammer Blue AC Rack- top level part number contains  19 different kits for AC rack

Chillers (DPS II): x2-H2000 & x4 ATS NX20A 

Coolant: DIEG/Galden

Chiller Hose Length: 75 feet


Hardware Configuration

Process Chb 1,2,3,&4: DPS-II w/ TGN

Chamber hardwareAssy: MS411037-XA-BMA1A(consists of 24 individual kit assemblies)

Endpoint type (Eye D IEP): Endpoint type (Eye D IEP)

Plasma State Monitor: (1 per system)

ESC type: ESC, ASSY, 300MM DPS2

Single Ring- Ceramic single ring: w//.12 pocket

TMP (Shimadzu) 3400l: TMP 3000 l/s, BOC Edwards 

Upper Chamber Liner: Upper Chamber Liner

Lower Chamber Liner: Lower Chamber Liner

Inner SV Door: Inner SV Door

Tunable Gas Nozzle: w/ceramic weldment

RF Generator: (3 KW / 13.56 Mhz) (DPS2 #1 Bottom)

RF Generator: (1.5KW / 13.56 Mhz) (DS2 #2 Bottom)

Bias Match (DPS2): Bias Match (DPS2)

Source Match (DPS2): Source Match (DPS2)

Oring kit for Process Exp: Kalrez #8085

ESR80WN: EABARA

FRC located in Gas Panel: NSR# 618541-1


Gas Box Configuration

Gas line 1: Gas line 1-Cl2 400 sccm- GF125

Gas line 2: Gas line 2-Cl2 50 sccm- GF125

Gas line 3: Gas line 3-HBr 600 sccm- AE-PN780CBA

Gas line 4: Gas line 4-HE 200 sccm- GF125

Gas line 5: Gas line 5-N2 200 sccm- GF125

Gas line 6: Gas line 6-O2 500 sccm- GF125

Gas line 7: Gas line 7-O2 50 sccm- GF125

Gas line 8: Gas line 8-SF6 250 sccm- GF125

Gas line 9: Gas line 9- BCL3 400 sccm- GF125

Gas line 10: Gas line 10-CF4 250 sccm- GF125

Gas line 11: Gas line 11 NF3 100 sccm- GF125

Gas line 12: Gas line 12-Ar 400 sccm- GF125

Gas Panel: Standart


Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales


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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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