Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, G.K. (F15)

TOWA (OMRON) Laser Front Inc. SL473G

Asset ID: 209120

Print spec sheet

TOWA (OMRON) Laser Front Inc.

SL473G

Laser Scribe

Wafer Marking

Equipment details:

Date of Manufacture:

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: 7/8/2022

PROBE 15-3OMR_SL473G_LASER OMR SL473G LASER


TOWA (OMRON) LASERFRONT CORPORATION.

WAFER MARKER SL473G Specification

Laser Type : Nd:YAG laser (SHG) λ=532nm

Character Font : SEMI-OCR (Dot, Engraving) , OCR-B (Engraving)

Marking Target : Wafer surface observe-side (Option: Reverse-side, Both-side)

Throughput : 170pcs/h

Wafer Size : 12 inch

Power supply voltage : AC200V±20V, 20A , Single phase, 50/60Hz 

Vacuum utility required : -77±10kPa, 0.01㎥/min

Compressed air utility required : 560±40kPa, 0.01㎥/min

Dimension [mm] : Approx. 1,640(W)×1,920(D)×1,550(H)

Main unit Weight : Approx. 1,000kg

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