Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)
Etch/Ash/Clean - Plasma Processing
Date of Manufacture:
Currently Configured for: To be determined
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
DRY ETCH 15-3TEL_TLUDRM_OX_03AOXEB TEL DRM
No photos are provided by Fab15 since tool has been de-installed and is stored in an off-site warehouse.
Fab15 confirmed there were no missing or damaged parts.
| OEM | TEL | ||
| Tool Model | TeliusSP-DRM | ||
| Process | Oxide | ||
| Software Version (include revision #) | Ver6.75-Rev000-STD-6.75a | ||
| System Power Rating | 200 AC 3-Phase | ||
| Loading Configuration | 4 Loadport | ||
| Vendor Chm Model | Chemicals / Gases Used (not to use Micron Proprietary names) | ||||
| Chm/Unit Position 1 | Loder Module | ||||
| Chm/Unit Position 2 | Process ship 1 | Ar,C4F8,O2,CF4,CHF3,CH3F,CH2F2,N2,He | |||
| Chm/Unit Position 3 | Process ship 2 | Ar,C4F8,O2,CF4,CHF3,CH3F,CH2F2,N2,He | |||
| Chm/Unit Position 4 | Process ship 3 | Ar,C4F8,O2,CF4,CHF3,CH3F,CH2F2,N2,He | |||
| Description | Qty | |||||
| Tool: | ||||||
| Process Unit: | Model: | Remark | ||||
| Controller: | EC MC | 1 3 | ||||
| MFC/Pressure Unit: | FCS-DN FCSWR-DN 627BRETDD2P 627B11TDC2P | 36 3 3 3 | ||||
| Drive Mechanisms: | x-axis: linear motor y-axis, z-axis, θ: AC servo motor | SINFONIA | 1 1 | |||
| FOUP Opener: | SELOP12F25* | 3 | ||||
| Gas System: | Accumulation type(16line) Fujikin | 3 | ||||
| Exhuast System: | TMP DRY Pump | 3 0 |
| Chiller | UBRPD5A-1T | 3 |
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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