Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)
Date of Manufacture: 2006
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
A Nova tool or a DIW Booster unit is not included in tool if it is on configuration or in a picture.
Tool has stopped the operations and is still powered on. Fab15's clean room layout will not allow the tool to be removed until July 1st, 2023.
| Process | Buff | |
| Software Version | rp3T6.5_36AMJ1 | |
| System Power Rating | 200V 3-phase for system | |
| Loading Configuration | 3 loadport | |
| Vendor Chm Model | Chemicals / Gases Used | |
| Chm/Unit Position 1 | ___Platen1 - Line1____________________ | _____D9228_____________________________ |
| Chm/Unit Position 2 | ___Platen1 - Line2____________________ | _____N/A_______________________________ |
| Chm/Unit Position 3 | ___Platen1 - Line3____________________ | _____D9228_____________________________ |
| Chm/Unit Position 4 | ___Platen1 - Line4____________________ | _____N/A_______________________________ |
| Chm/Unit Position 5 | ___Platen2 - Line1____________________ | _____D9228_____________________________ |
| Chm/Unit Position 6 | ___Platen2 - Line2____________________ | _____N/A_______________________________ |
| Chm/Unit Position 7 | ___Platen2 - Line3____________________ | _____D9228_____________________________ |
| Chm/Unit Position 8 | ___Platen2 - Line4____________________ | _____N/A_______________________________ |
| Chm/Unit Position 9 | ___Platen3 - Line1____________________ | _____D9228_____________________________ |
| Chm/Unit Position 10 | ___Platen3 - Line2____________________ | _____N/A_______________________________ |
| Chm/Unit Position 11 | ___Platen3 - Line3____________________ | _____D9228_____________________________ |
| Chm/Unit Position 12 | ___Platen3 - Line4____________________ | _____N/A_______________________________ |
| Chm/Unit Position 13 | ___Brush 1-1____________________ | _____NH4OH_____________________________ |
| Chm/Unit Position 14 | ___Brush 2-1____________________ | _____FPM (HF+H2O2)_____________________________ |
| Description | Qty | |
| FI UNIT | 1 | |
| CLEANER MODULE | 1 | |
| POLISHER MODULE | 1 | |
| Tool config as below | ||
| Item | Type | AMRFK4KK (CMP415) |
| Tool Type | Reflexion Reflexion-LK Reflexion-LK Prime | Reflexion |
| Polisher | Exchanger
Input/Output Stage (Wafer detection method) | Water
pressure detection type + surface spray |
| Head wash kit | Yes | |
| Gap wash kit | Yes | |
| Pedestal | Ring shape | |
| Wash Tower | Yes | |
| MKS / SMC | MKS | |
| None | ||
| 3Zone/5Zone/Metal | 7 Zone | |
| Ring Type | Normal Type | |
| Wafer loss sensor | Dark pad correspondence | |
| Head Assy | DDF3 | |
| Disk clean cup | None (DIW spray come out from the side and bottom) | |
| Torque Monitor kit | Yes | |
| FULL VISION | None | |
| RTPC | None | |
| Reflexion Normal Type | ||
| Normal or High Flow | Normal | |
| Platen1 - Line1 | D9228 | |
| Platen1 - Line2 | Not using | |
| Platen1 - Line3 | D9228 | |
| Platen1 - Line4 | Not using | |
| Platen2 - Line1 | D9228 | |
| Platen2 - Line2 | Not using | |
| Platen2 - Line3 | D9228 | |
| Platen2 - Line4 | Not using | |
| Platen3 - Line1 | D9228 | |
| Platen3 - Line2 | Not using | |
| Platen3 - Line3 | D9228 | |
| Platen3 - Line4 | Not using | |
| Platen4 - Line1 | None | |
| Platen4 - Line2 | None | |
| Platen4 - Line3 | None | |
| Platen4 - Line4 | None | |
| Tubing Pomp Flow Controller | Flow
Controller (Asahiyukizai) | |
| None | ||
| None | ||
| Clenaer | Pass
thru Station Design | 1Piece |
| Roller | 0040-87416 (Amat Original) | |
| Spray DIW | 1040-01183 (90-1000cc) | |
| Wafer rotate | 3 Roller + 1 Idler | |
| Brush rotate | Belt Drive | |
| Brush gap adjustment | Spacer block | |
| Brush opening adjustment | Air cylinder + Hard Stop | |
| Meｇ-1 | - | |
| Meｇ-2 | - | |
| Brush 1 composition（Chem) | Pressurized (75ml Full) | |
| Brush 1-1 | NH4OH | |
| Brush 1-2 | - | |
| Brush 2-1 | FPM | |
| Brush 2-2 | - | |
| Brush1 Chem | 1040-01195 (FutureStar 5-75cc) | |
| Brush1 Spray DIW | 1040-00191 (TOKYO KEISO 0.4-4L) | |
| Brush1 Brush Inner Rinse | 1040-00191 (TOKYO KEISO 0.4-4L) | |
| Brush2 Chem | 1040-00191 (TOKYO KEISO 0.4-4L) | |
| Brush2 Spray DIW | 1040-00191 (TOKYO KEISO 0.4-4L) | |
| Brush2 Brush Inner Rinse | 1040-00191 (TOKYO KEISO 0.4-4L) | |
| Idler | "Only
the washer part can be replaced + No inner ring " | |
| Wafer Roller | Nippou Sangyo | |
| Method | Spindry + Heater | |
| SRD, IPA Vapar | SRD | |
| SRD Sheald | Hydrophilic type | |
| Heater On Detect Hardware | Yes | |
| SRD Front | 1040-01194 (90-1000cc) | |
| SRD Rear | 1040-01194 (90-1000cc) | |
| Robot | FFU | Differential pressure adjust type (manual mode possible) |
| Maker (Type) | Kawasaki | |
| Wafer Holding mechanism | Plunger | |
| Maker (Type) | kawasaki | |
| Wafer Holding mechanism | Plunger | |
| Walking beam Running beam | Walking Beam | |
| Other | Yes | |
| 3060 / 3090 / i500 / i500+ | NOVA i500 | |
| Cognex License ON/OFF | ON | |
| COX-3EN2 | None | |
| Unit /Rev | None | |
| Chemical | - | |
| Reflexion , Reflexion-LK | None | |
| None | ||
| None | ||
| Soft Ver | rp3T6.5_36AMJ1 | |
| cb3.2_45 | ||
| IB21e9 | ||
| - | ||
| B3.1 | ||
| 4.4.R3-PA3b3 | ||
| 6.2 |
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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